Ink Degasser
TEL:18925129293
Conductive Ink Defoaming Machine
Solve bubbles and agglomeration of conductive ink · Dense circuit, stable printing and consistent sheet resistance
Vacuum defoaming + Disperse agglomerated conductive particles + Non-contact design for cleanliness and no contamination
SIENOX conductive ink defoaming solution addresses the problems of air entrapment and particle agglomeration during stirring caused by conductive particles contained in conductive ink. It performs stirring, defoaming and dispersion simultaneously under vacuum, delivering dense and uniform conductive circuits with stable printing performance, reducing broken lines, pinholes and sheet resistance fluctuation.
✓ CE certification ✓ ISO9001 Quality Management System ✓ RoHS compliance ✓ Custom voltage available (110V/220V)
Why a Conductive Ink Defoaming Machine Is Required
Printed Electronic CircuitsWhen conductive ink is used to print flexible circuits, air bubbles and particle agglomerates generated during stirring will cause broken lines, pinholes and circuit defects, directly impairing the integrity of conductive paths. | Consistent Electrical PerformanceBubbles and agglomeration lead to uneven printed film thickness and sheet resistance fluctuation, causing unstable batch performance of devices such as sensors and heating films and reducing product yield. | High Cleanliness & High-value MaterialConductive ink is high-cost and sensitive to impurities and cleanliness. No contamination or change of particle dispersion state shall be introduced during defoaming. |
✨ Traditional challenges: Manual stirring entrains air and causes particle agglomeration, resulting in unstable sheet resistance and intermittent conductivity of printed circuits. Synchronous vacuum defoaming and dispersion is therefore required.
Why Choose SIENOX Conductive Ink Defoaming Solution
Integrated Defoaming & DispersionVacuum stirring achieves defoaming and breaks up agglomerated conductive particles simultaneously for denser circuits and better printability. | Clean Non-contact DesignNo impeller contact with materials. It will not contaminate conductive systems and ensures consistent sheet resistance and conductive performance across batches. | Scalable from R&D to Mass ProductionC/ZK series supports milliliter-level formula development, while MIX1000plus scales up for mass production with seamless replication of process parameters. |
✨ The MIX series serves as ideal defoaming equipment for offset printing ink from color matching to bulk ink supply.
Equipment Supporting Description
Supporting Process Workflow Weigh resin and powder → Vacuum stirring, mixing and degassing → Discharging for pressing / casting → Curing / sintering. | ![]() |
Specifications & Parameters
Selection Guide
| Conductive Ink Application | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Formula R&D / Sampling | Small amount of conductive ink | Centrifugal / vacuum defoaming and dispersion | C Series / ZK Series |
| Printed conductive circuits | Medium to high viscosity | Vacuum stirring, defoaming and dispersion | MIX60 / MIX1000plus |
| Mass printing production | Bulk ink material | Vacuum stirring, defoaming and dispersion | MIX1000plus |
| High-precision conductive parts | Medium to high viscosity | Vacuum stirring + pressure fine defoaming | MIX1000plus / RX Series |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
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搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
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为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Conductive Ink Application | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Formula R&D / Sampling | Small amount of conductive ink | Centrifugal / vacuum defoaming and dispersion | C Series / ZK Series |
| Printed conductive circuits | Medium to high viscosity | Vacuum stirring, defoaming and dispersion | MIX60 / MIX1000plus |
| Mass printing production | Bulk ink material | Vacuum stirring, defoaming and dispersion | MIX1000plus |
| High-precision conductive parts | Medium to high viscosity | Vacuum stirring + pressure fine defoaming | MIX1000plus / RX Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
Printed ElectronicsFlexible circuits, printed circuits, conductive patterns |
Flexible SensorsPrinting of pressure, temperature and strain sensors |
Printed AntennasNFC/RFID antenna and conductive circuit printing |
Membrane SwitchesPrinting of conductive keys and flexible circuits |
Heating FilmsPrinting of flexible heating films and electric heating sheets |
Conductive Ink FactoryConductive ink R&D, color matching and filling |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste Materials |
Adhesive with Powder |
Polymer Materials |
Pharmaceutical Gel |
Silver Paste Materials |
Battery Slurry |
Precautions for Use
| Notes | Operation Instructions |
| Loading & Rotation Speed | Match loading capacity and rotation speed for high-solid-content conductive ink to prevent sedimentation and uneven dispersion of conductive particles. |
| Anti-oxidation & Anti-contamination | Avoid oxidation of metallic conductive particles and cross-contamination; keep tools and containers clean. |
| Slow Pressure Relief | Release pressure slowly after defoaming to prevent re-foaming and splashing of high-solid ink. |
| Prompt Printing | Perform printing as soon as possible after defoaming and dispersion to avoid re-agglomeration or sedimentation of particles during standing. |
* Internal laboratory test data. Actual results vary depending on ink formula and printing process. Contact sales for real customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.















