Slurry Degasser
TEL:18925129293
Solder Paste Defoaming Machine
Eliminate bubbles and splashing of solder paste · Full solder joints, fewer solder beads & stable printing
Vacuum defoaming reduces printing bubbles + No change to flux system + Flexible for small batches
SIENOX solder paste defoaming solution solves problems including entrapped air after SMT solder paste stirring, printing slumping, solder splashing and solder beads. Vacuum defoaming enables stable solder paste printing, full solder joints and fewer solder beads and cold solder joints.
✓ CE certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom voltage available (110V/220V)
Why Do We Need Solder Paste Defoaming Machine
SMT PrintingAir entrapped after solder paste stirring causes slumping, stringing and pinholes when printed on PCB, impairing printed pattern integrity and SMT yield rate. | Solder Splashing & Solder BeadsBubbles inside paste expand and burst under heat during reflow soldering, generating splashed solder beads which lead to short circuits, tombstoning and other soldering defects with high rework cost. | Precision Electronic AssemblyPrecision SMT and underfill require high consistency of solder joints. Bubbles and uneven paste directly compromise solder joint reliability. |
✨ Traditional Dilemma: Air is trapped after solder paste stirring, leading to bursting and solder bead formation during reflow soldering. Manual defoaming risks altering flux activity. Gentle vacuum defoaming is required.
Why Choose SIENOX Solder Paste Defoaming Solution
Reduce Solder Bead SplashingVacuum removes bubbles inside paste to cut solder bursting and solder bead splashing during reflow and form plump solder joints. | Preserve Flux SystemGentle non-contact defoaming keeps flux activity and printing performance of solder paste unchanged. | Flexible for Small BatchesC/ZK series supports small-batch sampling and color change. MIX series for mass production enables stable and repeatable printing results. |
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Equipment Supporting Description
Supporting Process Workflow Weigh resin and powder → Vacuum stirring, mixing and degassing → Discharge for compacting / casting → Curing / sintering. |  |
Specifications & Parameters
Selection Guide
| Solder Paste Application | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Small Batch / Sample Test | Small amount of solder paste | Centrifugal / Vacuum Defoaming | C Series / ZK Series |
| Conventional SMT Solder Paste | High-viscosity paste | Vacuum Defoaming | MIX60 |
| Precision Assembly / Underfill | High-viscosity paste | Vacuum Stirring and Defoaming | MIX Series / MIX1000plus |
| High-demand Solder Joints | High viscosity | Vacuum stirring + Pressure Fine Defoaming | MIX1000plus / RX Series |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么？用于哪些行业？
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备，脱泡同时混料，避免二次气泡混入，常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理，广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备？
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势？
源头厂家直供可省去中间环节，价格更透明，同时能提供参数定制、来料试机、工艺验证等服务，售后响应更直接。
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搅拌脱泡机的工作原理？
施诺斯设备采用行星式混合原理：料罐在自转的同时绕公转轴公转，物料在罐内随之翻动混合，同时抽真空脱泡。整个过程设备不设搅拌桨，搅拌部件不接触物料，不会引入金属异物，混合均匀不分层。
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为什么选择施诺斯？
施诺斯（SIENOX）是广州施诺斯科技股份有限公司旗下品牌，2014 年成立，专注脱泡机与搅拌机的研发与制造，团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计，不设搅拌桨，行星式公转加自转运动辅以真空系统，高效除泡，混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材，广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证，拥有 30 余项专利，服务富士康、比亚迪、清华大学等企业与科研院所。
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Solder Paste Application | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Small Batch / Sample Preparation | Small amount of solder paste | Centrifugal / Vacuum Defoaming | C Series / ZK Series |
| Conventional SMT Solder Paste | High-viscosity paste | Vacuum Defoaming | MIX60 |
| Precision Assembly / Underfill | High-viscosity paste | Vacuum Stirring and Defoaming | MIX Series / MIX1000plus |
| High-spec Solder Joints | High viscosity | Vacuum stirring + Pressure Fine Defoaming | MIX1000plus / RX Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
SMT MountingPCB mounting and soldering |
Solder Paste PrintingStencil printing and solder paste defoaming |
Precision AssemblyPrecision electronics and module assembly |
UnderfillUnderfill encapsulant |
Solder Paste ProductionR&D and filling of solder paste |
Electronic ManufacturingConsumer electronics and automotive electronics |
Comprehensive Equipment Operation Demo Videos
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste Materials |
Adhesive with Powder |
Polymer Materials |
Pharmaceutical Gel |
Silver Paste Materials |
Battery Slurry |
Precautions for Use
| Notes | Operation Instructions |
| Cold Chain Tempering | Solder paste shall be stored at low temperature as required. Fully temper before defoaming and stirring. |
| Gentle Defoaming | Control rotating speed and vacuum level to prevent excessive stirring from impairing printability and flux activity of solder paste. |
| Slow Pressure Relief | Release pressure slowly after defoaming to avoid re-foaming of paste. |
| Prompt Use | Print as soon as possible after defoaming to prevent moisture absorption or grain coarsening of solder paste. |
* Internal laboratory test data. Actual results vary with solder paste formulation and soldering process. Contact sales for real customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.
