Slurry Degasser

TEL:18925129293

Thermal Conductive Slurry Defoaming Machine


Resolve Bubbles & Agglomeration in Thermal Conductive Slurry · Dense Thermal Layer, Low Thermal Resistance & Uniform Filling

Vacuum Defoaming + Break Up Thermal Filler Agglomerates + Reduce Interfacial Thermal Resistance

SIENOX thermally conductive slurry defoaming solution targets air entrapment and agglomeration problems of thermal grease, thermal gel and thermal interface materials filled with high-conductivity fillers like aluminum oxide and boron nitride. It realizes stirring, defoaming and dispersion synchronously under vacuum to form dense thermal conductive layers and reduce thermal resistance.

✓ CE certification  ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom voltage available (110V/220V)

在线留言 免费寄样测试 工程师热线:189-2512-9293

Why Do We Need Thermal Conductive Slurry Defoaming Machine

Power Device Heat Dissipation

Thermal grease or gel is applied to fill thermal interfaces of IGBT and power modules. Air voids increase thermal resistance, resulting in poor chip heat dissipation, temperature rise and shortened service life.

High Filler Agglomeration

High thermal conductive fillers such as aluminum oxide and boron nitride are prone to agglomeration. Air trapped during stirring breaks thermal conduction paths, degrading thermal performance and causing batch fluctuations.

LED & Lithium Battery

LED heat dissipation and lithium battery thermal management demand high thermal consistency. Air voids trigger local hot spots and impair reliability and safety.

✨ Traditional Dilemma: Manual stirring of high-filler pastes causes both air entrapment and filler agglomeration, leading to unstable thermal resistance. Synchronous vacuum defoaming and dispersion is required.

Why Choose SIENOX Thermal Conductive Slurry Defoaming Solution

Bubble Removal for Lower Thermal Resistance

Removing air voids enables tighter contact between fillers, forms continuous thermal conduction paths, reduces interfacial thermal resistance and delivers more reliable heat dissipation.

Break Filler Agglomerates

Rotational shear breaks up agglomerates of aluminum oxide and boron nitride for even filler distribution and stable thermal conductivity consistency.

Non-contact & Clean

No contamination to thermal conductive systems with reproducible formulations. Smooth scale-up from lab samples to mass batches.

✨

Equipment Supporting Description

Supporting Process Workflow 

Weigh resin and powder → Vacuum stirring, mixing and degassing → Discharge for compaction / casting → Curing / sintering.

Stirring and Defoaming Working Principle 03.jpg

Specifications & Parameters

Selection Guide

Thermal Conductive Slurry TypeTypical StateRecommended Defoaming MethodRecommended Equipment
Formula R&D / SamplingSmall quantity of thermal conductive materialCentrifugal / Vacuum DefoamingC Series / ZK Series
Thermal GreaseHigh-viscosity pasteVacuum stirring, defoaming & dispersionMIX60 / MIX80
Thermal Gel / Shim MaterialHigh-viscosity pasteVacuum stirring, defoaming & dispersionMIX1000plus
High-Thermal-Density FillingHigh filler loadingVacuum stirring + pressure fine defoamingMIX1000plus / RX Series

我们的合作伙伴

深受全球知名工业制造集群及前沿高校实验室信赖

合作伙伴展示

FAQ 您关心的问题

为您解答关于产品性能及日常工艺选型中的常见疑问

  • 真空脱泡搅拌机是什么?用于哪些行业?

    真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。

  • 广州施诺斯主要生产哪些设备?

    主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。

  • 源头厂家采购脱泡设备有什么优势?

    源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。

  • 搅拌脱泡机的工作原理?

    施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。

  • 为什么选择施诺斯?

    施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

Thermal Conductive Slurry TypeTypical StateRecommended Defoaming MethodRecommended Equipment
Formula R&D / SamplingSmall quantity of thermal conductive materialCentrifugal / Vacuum DefoamingC Series / ZK Series
Thermal GreaseHigh-viscosity pasteVacuum stirring, defoaming & dispersionMIX60 / MIX80
Thermal Gel / Shim MaterialHigh-viscosity pasteVacuum stirring, defoaming & dispersionMIX1000plus
High-Thermal-Density FillingHigh filler loadingVacuum stirring + pressure fine defoamingMIX1000plus / RX Series

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

Power Devices.jpg

Power Devices

Thermal filling for IGBT and modules

LED Heat Dissipation.jpg

LED Heat Dissipation

LED packaging & lamp thermal conduction

Power Battery.jpg

Power Battery

Battery pack thermal management & thermal gel

Thermal Grease.jpg

Thermal Grease

Grease for CPU and power devices

Thermal Gel.jpg

Thermal Gel

Thermal gel and shim materials

Thermal Material Factory.jpg

Thermal Material Manufacturer

Thermal material R&D and filling

Comprehensive Equipment Operation Demo Videos

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

润滑油搅拌脱泡.jpg

膏状材料

光刻胶搅拌脱泡.jpg

胶水+粉体

高分子材料.jpg

高分子材料

凝胶脱泡02.jpg

医药凝胶

银浆粉搅拌脱泡.jpg

银浆材料

电池浆料+胶粘剂搅拌脱泡.jpg

电池浆料

Precautions for Use

NotesOperation Instructions
Loading & Rotation SpeedHigh-filler materials tend to sink. Match cup loading volume with rotation speed to ensure uniform filler dispersion.
Heating for Viscosity ReductionHigh-viscosity thermal conductive pastes can be properly heated to lower viscosity before defoaming for higher efficiency.
Slow Pressure ReliefRelease pressure slowly after defoaming to prevent re-foaming of paste.
Contamination PreventionAvoid cross-contamination between different filler systems and keep tools and containers clean.

* Internal laboratory test data. Actual results vary with slurry formulation and application process. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


真空脱泡搅拌机:彻底解决UV胶固化难题01.jpg

Stirring‑Defoaming Solution for Glue Materials in Consumer‑Electronics Industry


施诺斯真空脱泡搅拌机在胶粘剂中的解决方案.jpg

Vacuum Defoaming Solution for Consumer Electronics Adhesives


涂膜材料01.jpg

Industrial University Solves Bubble Challenges of Coating‑Film Materials with SIENOX Defoaming Machine

返回顶部