Slurry Degasser
TEL:18925129293
Thermal Conductive Slurry Defoaming Machine
Resolve Bubbles & Agglomeration in Thermal Conductive Slurry · Dense Thermal Layer, Low Thermal Resistance & Uniform Filling
Vacuum Defoaming + Break Up Thermal Filler Agglomerates + Reduce Interfacial Thermal Resistance
SIENOX thermally conductive slurry defoaming solution targets air entrapment and agglomeration problems of thermal grease, thermal gel and thermal interface materials filled with high-conductivity fillers like aluminum oxide and boron nitride. It realizes stirring, defoaming and dispersion synchronously under vacuum to form dense thermal conductive layers and reduce thermal resistance.
✓ CE certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom voltage available (110V/220V)
Why Do We Need Thermal Conductive Slurry Defoaming Machine
Power Device Heat DissipationThermal grease or gel is applied to fill thermal interfaces of IGBT and power modules. Air voids increase thermal resistance, resulting in poor chip heat dissipation, temperature rise and shortened service life. | High Filler AgglomerationHigh thermal conductive fillers such as aluminum oxide and boron nitride are prone to agglomeration. Air trapped during stirring breaks thermal conduction paths, degrading thermal performance and causing batch fluctuations. | LED & Lithium BatteryLED heat dissipation and lithium battery thermal management demand high thermal consistency. Air voids trigger local hot spots and impair reliability and safety. |
✨ Traditional Dilemma: Manual stirring of high-filler pastes causes both air entrapment and filler agglomeration, leading to unstable thermal resistance. Synchronous vacuum defoaming and dispersion is required.
Why Choose SIENOX Thermal Conductive Slurry Defoaming Solution
Bubble Removal for Lower Thermal ResistanceRemoving air voids enables tighter contact between fillers, forms continuous thermal conduction paths, reduces interfacial thermal resistance and delivers more reliable heat dissipation. | Break Filler AgglomeratesRotational shear breaks up agglomerates of aluminum oxide and boron nitride for even filler distribution and stable thermal conductivity consistency. | Non-contact & CleanNo contamination to thermal conductive systems with reproducible formulations. Smooth scale-up from lab samples to mass batches. |
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Equipment Supporting Description
Supporting Process Workflow Weigh resin and powder → Vacuum stirring, mixing and degassing → Discharge for compaction / casting → Curing / sintering. | ![]() |
Specifications & Parameters
Selection Guide
| Thermal Conductive Slurry Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Formula R&D / Sampling | Small quantity of thermal conductive material | Centrifugal / Vacuum Defoaming | C Series / ZK Series |
| Thermal Grease | High-viscosity paste | Vacuum stirring, defoaming & dispersion | MIX60 / MIX80 |
| Thermal Gel / Shim Material | High-viscosity paste | Vacuum stirring, defoaming & dispersion | MIX1000plus |
| High-Thermal-Density Filling | High filler loading | Vacuum stirring + pressure fine defoaming | MIX1000plus / RX Series |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
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搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
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为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Thermal Conductive Slurry Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Formula R&D / Sampling | Small quantity of thermal conductive material | Centrifugal / Vacuum Defoaming | C Series / ZK Series |
| Thermal Grease | High-viscosity paste | Vacuum stirring, defoaming & dispersion | MIX60 / MIX80 |
| Thermal Gel / Shim Material | High-viscosity paste | Vacuum stirring, defoaming & dispersion | MIX1000plus |
| High-Thermal-Density Filling | High filler loading | Vacuum stirring + pressure fine defoaming | MIX1000plus / RX Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
Power DevicesThermal filling for IGBT and modules |
LED Heat DissipationLED packaging & lamp thermal conduction |
Power BatteryBattery pack thermal management & thermal gel |
Thermal GreaseGrease for CPU and power devices |
Thermal GelThermal gel and shim materials |
Thermal Material ManufacturerThermal material R&D and filling |
Comprehensive Equipment Operation Demo Videos
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
膏状材料 |
胶水+粉体 |
高分子材料 |
医药凝胶 |
银浆材料 |
电池浆料 |
Precautions for Use
| Notes | Operation Instructions |
| Loading & Rotation Speed | High-filler materials tend to sink. Match cup loading volume with rotation speed to ensure uniform filler dispersion. |
| Heating for Viscosity Reduction | High-viscosity thermal conductive pastes can be properly heated to lower viscosity before defoaming for higher efficiency. |
| Slow Pressure Relief | Release pressure slowly after defoaming to prevent re-foaming of paste. |
| Contamination Prevention | Avoid cross-contamination between different filler systems and keep tools and containers clean. |
* Internal laboratory test data. Actual results vary with slurry formulation and application process. Contact sales for real customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.















