SIENOX Adhesive Material Solutions

Working Condition Requirements: Thoroughly and uniformly mix resins, curing agents, high‑proportion fillers and various additives in high‑viscosity adhesives (epoxy resin, thermal conductive silicone, polyurethane, etc.), and remove bubbles generated during stirring. High‑viscosity systems feature poor flowability and bubbles are harder to escape. After defoaming, the adhesive shall be uniform and fine without residual bubbles. No adhesive break‑off or hollow defects shall occur during dispensing / potting. After curing, bonding strength shall meet standards with defect‑free surfaces.

Comparison Before and After Improvement

Before Improvement: A well‑known adhesive manufacturer originally adopted traditional mechanical stirring plus static defoaming process with the following problems:

• Traditional stirring paddles deliver low mixing efficiency for high‑viscosity adhesives such as epoxy resin and thermal conductive silicone. Uneven mixing of A/B components leads to partial uncured areas after curing.

• Static defoaming for high‑viscosity adhesives is extremely difficult, taking 4‑8 hours or even longer. Bubbles can hardly escape naturally from thick colloids, severely slowing down production cycles.

• Stirring paddles are hard to clean. Large amounts of solvent are required for flushing when switching formulas, causing material waste and cross‑contamination.

• Stubborn micro‑bubbles inside adhesives cannot be removed effectively, resulting in hollows and air bubbles after dispensing, decreased bonding strength and unqualified appearance after curing.

• Bulky equipment occupies large floor space, and operation relies heavily on operator experience.

Solutions: According to the actual requirements of this adhesive manufacturer, SIENOX provides planetary vacuum stirring‑defoaming machine and supporting solutions:

1. Planetary dual‑track stirring: Combined revolution and rotation realize three‑dimensional mixing of adhesive components under centrifugal force field. Uniform dispersion can be achieved without stirring paddles. Excellent consistency for A/B adhesive mixing and even filler distribution.

2. Integrated vacuum defoaming: The vacuum system starts synchronously during stirring. Bubbles expand and rupture under negative pressure environment. Mixing and defoaming are completed in one process within only 5‑15 minutes, replacing traditional 2‑6‑hour static defoaming.

3. Non‑contact design: No stirring paddle required. Only container outer wall cleaning or container replacement is needed for formula / adhesive switching, avoiding cross‑contamination and reducing solvent consumption.

4. PLC multi‑segment program control: Multiple groups of stirring parameters (speed, time, vacuum degree) can be stored. One‑click call of exclusive process programs for different adhesive formulas lowers reliance on operator experience.

Sample Provider: A well‑known domestic adhesive manufacturer

Test Conditions

Effect Comparison Before and After Stirring

Mature Application Fields

• Epoxy AB Adhesive (structural bonding / potting / pouring)

• UV‑curing Adhesive (optical bonding / glass fixing / electronic packaging)

• Silicone Sealant / Thermal Conductive Silicone (electronic heat dissipation / waterproof sealing)

• Polyurethane Structural Adhesive (automotive / construction / composite materials)

• Anaerobic Adhesive (thread locking / bearing retaining / flat‑surface sealing)

• Acrylate Structural Adhesive (metal / plastic bonding)

• Conductive Adhesive / Silver Paste (electronic assembly / chip packaging)

• Hot‑melt Adhesive (packaging / automotive / electronic product assembly)

• Electronic Potting Compound (power supply / sensor / control module)

• Optical Adhesive / LOCA (touch screen / lens assembly)

***SIENOX has more than 1800 material stirring‑defoaming cases, free sample testing and trial machine test available