Adhesive

Do bubbles in thermal conductive glue degrade thermal conductivity? SIENOX provides practical test cases for thermal conductive glue defoaming. Free sample testing by mail available.

Solve bubble challenges during mixing and stirring of A/B two-component materials, full coverage from epoxy to acrylic structural adhesives

SIENOX planetary mixer‑defoamer (SIENOX) employs revolution‑rotation mixing technology and a fully enclosed non‑contact defoaming system to deliver end‑to‑end solutions from R&D to mass production for high‑viscosity structural adhesives such as epoxy resin and polyurethane, helping customers realize zero‑defect bonding fabrication.

SIENOX has 20‑year‑long expertise in consumer‑electronics glue stirring‑defoaming, offering vacuum stirring‑defoaming solutions for adhesives for phone assembly, tablet bonding, wearables, camera modules and waterproof sealing.

SIENOX boasts 20‑year expertise in stirring and defoaming for high‑viscosity adhesives, offering vacuum stirring‑defoaming solutions for epoxy resin, AB glue, thermal‑conductive silicone, polyurethane and other high‑viscosity binders.

SIENOX brings 20‑year expertise in semiconductor packaging adhesive mixing‑defoaming.
Our vacuum defoaming solutions remove nano‑scale micro‑bubbles for uniform die attach, molding compound, underfill and dam‑fill materials.
Boost chip packaging reliability and yield; free sample testing & trial‑test services offered.