Adhesive Degasser
TEL:18925129293
Conductive Adhesive Defoaming Machine
Eliminate Bubbles & Filler Agglomeration for Conductive Adhesives · Continuous Conductive Path and Low Contact Resistance
Vacuum Defoaming + Disperse Conductive Fillers + Non-contact Design Without Contaminating High-value Adhesives
SIENOX conductive adhesive defoaming solution solves the problem of air entrapment and agglomeration of silver/nickel-silver fillers in conductive epoxy and conductive bonding adhesives. Mixing, defoaming and dispersion are completed simultaneously under vacuum to achieve dense adhesive layers, continuous conductivity and stable low contact resistance.
✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)
Why Need Conductive Adhesive Defoaming Machine
Conductive Bonding of ComponentsConductive adhesives are used for bonding and grounding of electronic components and shielding cans. Bubbles and filler agglomeration will cause discontinuous conductivity, high contact resistance and failure of shielding grounding. | Filler AgglomerationSilver / nickel-silver conductive fillers tend to agglomerate and trap air, breaking conductive paths in adhesive layers and causing batch fluctuation of resistance. | High-value AdhesivesSilver-filled conductive adhesives come with high material cost. Insufficient defoaming leads to dispensing voids and defective products, so a stable and reproducible defoaming process is required. |
✨ Traditional Dilemma: Conductive adhesives suffer from both air entrapment and filler agglomeration, resulting in fluctuating conductive resistance and voids during dispensing. Synchronized vacuum defoaming and dispersion is required.
Why Choose SIENOX Conductive Adhesive Defoaming Solution
Continuous ConductivityVacuum defoaming and conductive filler dispersion deliver dense adhesive layers with continuous conductive paths and low, stable contact resistance. | Clean Non-contact OperationNo contamination to high-value conductive adhesives and no ratio change, ensuring consistent bonding and conductive performance across batches. | Smooth Scale-upC/ZK series for formula sampling, MIX series for mass production; process parameters can be scaled up smoothly. |
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Equipment Supporting Description
SIENOX AB adhesive defoaming solution can be combined with other equipment to form a complete potting process chain: Integrated Mixing & Defoaming: MIX series mixers complete mixing of AB adhesives and synchronous defoaming under vacuum, finishing mixing and bubble removal in one single process. Temperature-controlled Defoaming: WK series temperature-controlled defoamers perform defoaming at preset temperatures. Suitable for high-viscosity AB adhesives to reduce viscosity by heating and improve defoaming efficiency. Defoaming & Dispensing Linkage: Directly connect to SIE-301/302/303 dispensers for potting after defoaming to avoid new bubbles introduced during material transfer. Pressurized Fine Defoaming: For scenarios requiring high defoaming rate, transfer materials to RX pressurized defoamer for secondary fine defoaming after vacuum mixing to achieve higher defoaming performance. | ![]() |
Specifications & Parameters
Selection Guide
| Conductive Adhesive Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| R&D Sampling | Small batch of adhesive | Centrifugal / Vacuum Defoaming & Dispersion | C Series / ZK Series |
| Conductive Epoxy Adhesive | High-viscosity Paste | Vacuum Mixing, Defoaming & Dispersion | MIX60 / MIX80 |
| EMI Shielding Conductive Adhesive | Medium to High Viscosity | Vacuum Mixing, Defoaming & Dispersion | MIX Series / MIX1000plus |
| High-precision Conductive Bonding | High Viscosity | Vacuum Mixing + Pressurized Fine Defoaming | MIX1000plus / RX Series |
我们的合作伙伴
深受全球知名工业制造集群及前沿高校实验室信赖
FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
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搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
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为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Conductive Adhesive Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| R&D Sampling | Small volume adhesive | Centrifugal / Vacuum Defoaming & Dispersion | C Series / ZK Series |
| Conductive Epoxy Adhesive | High-viscosity Paste | Vacuum Mixing, Defoaming & Dispersion | MIX60 / MIX80 |
| EMI Shielding Conductive Adhesive | Medium to High Viscosity | Vacuum Mixing, Defoaming & Dispersion | MIX Series / MIX1000plus |
| High-precision Conductive Bonding | High Viscosity | Vacuum Mixing + Pressurized Fine Defoaming | MIX1000plus / RX Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
Conductive BondingConductive bonding and grounding for electronic components |
EMI ShieldingShielding cans and conductive sealing |
Chip BondingDie attach conductive bonding for chips |
Photovoltaic ModulesConductive bonding for modules |
Automotive ElectronicsOn-board conductive bonding and grounding |
Conductive Adhesive ManufacturersR&D and filling of conductive adhesives |
Full-range Equipment Operation Demo Videos
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste Materials |
Adhesives & Powders |
Polymer Materials |
Pharmaceutical Gels |
Silver Paste Materials |
Battery Slurries |
Precautions for Use
| Precautions | Operating Instructions |
| Loading & Rotation Speed | Conductive fillers tend to sink to the bottom. Match the cup loading volume with rotation speed to ensure uniform filler dispersion. |
| Anti-oxidation & Anti-contamination | Prevent oxidation of silver fillers and cross-contamination; keep tools and containers clean. |
| Slow Pressure Relief | Release pressure slowly after defoaming to avoid foaming and splashing of paste materials. |
| Timely Dispensing | Perform dispensing promptly after defoaming and dispersion to prevent filler agglomeration and sedimentation during standing. |
* Internal laboratory test data. Actual results vary depending on adhesive formulation and dispensing process. Contact sales for real customer cases.
Customer Delivery & Application Cases
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