Adhesive Degasser
TEL:18925129293
Structural Adhesive Defoaming Machine
Eliminate Mixing Bubbles and Bonding Voids in Structural Adhesives · Dense Adhesive Layer & Stable Bonding Strength
Simultaneous Mixing & Defoaming + Dense Adhesive Layer with Stable Strength + Non-contact Operation Without Changing Mixing Ratio
SIENOX structural adhesive defoaming solution addresses air entrapment and void formation in adhesive layers after mixing structural adhesives such as acrylic and modified epoxy. Mixing and defoaming are performed synchronously under vacuum to achieve dense and uniform adhesive layers with stable and reliable bonding strength.
✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)
Why Structural Adhesive Defoaming Machine Is Required
Metal Structural BondingWhen structural adhesives are used for bonding metal parts and sheet metals, trapped air after mixing creates voids in the adhesive layer. Stress concentration occurs under load, resulting in reduced bonding strength, cracking and debonding. | Automotive & TransportationStructural bonding for vehicle bodies and battery packs requires high bonding strength. Bubbles and voids degrade durability and impact resistance, making batch consistency hard to guarantee. | Composite Material BondingStructural adhesive layers for carbon fiber and composite materials need to be dense. Bubble defects impair overall structural strength and fatigue life. |
✨ Traditional Dilemma: Manual mixing of two-part adhesives causes both air entrapment and uneven blending, leading to voids in adhesive layers and inconsistent bonding strength. Synchronous vacuum mixing and defoaming is therefore required.
Why Choose SIENOX Structural Adhesive Defoaming Solution
Integrated Mixing & DefoamingMixing and defoaming proceed simultaneously under vacuum. Uniform blending and bubble removal are completed in one single process for dense adhesive layers. | Stable Bonding StrengthNon-contact mixing keeps the mixing ratio unchanged. Bonding strength remains consistent batch-to-batch after curing, reducing false bonding and debonding. | Scalable ProcessC/ZK series supports small sample formulation development, while MIX series serves mass production. Process parameters can be scaled up smoothly. |
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Equipment Supporting Description
SIENOX AB adhesive defoaming solution can be combined with other equipment to form a complete potting process chain.
SIENOX AB adhesive defoaming solution can work with other equipment to form a complete potting process chain: Integrated Mixing & Defoaming: MIX series planetary mixers blend AB adhesives and perform synchronous defoaming under vacuum, finishing mixing and bubble removal in one single process. Temperature-controlled Defoaming: WK series temperature-controlled defoamers operate at preset temperatures. They are suitable for high-viscosity AB adhesives which can be heated to reduce viscosity for higher defoaming efficiency. Defoaming & Dispensing Linkage: Directly connect to SIE-301/302/303 dispensers for potting after defoaming to minimize new bubbles generated during intermediate transfer. Pressurized Fine Defoaming: For applications demanding high defoaming rate, materials can go through secondary fine defoaming in RX pressurized defoamers after planetary vacuum mixing for superior bubble removal performance. | ![]() |
Specifications & Parameters
Selection Guide
| Structural Adhesive Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Formulation R&D / Small Sampling | Small Volume Adhesive | Centrifugal / Vacuum Mixing & Defoaming | C Series / ZK Series |
| Acrylic Structural Adhesive | Medium Viscosity | Vacuum Mixing & Defoaming | MIX60 / MIX80 |
| Modified Epoxy Structural Adhesive | Medium to High Viscosity | Vacuum Mixing & Defoaming | MIX Series / MIX1000plus |
| High-strength Structural Adhesive Layer | High Viscosity | Vacuum Mixing + Pressurized Fine Defoaming | MIX1000plus / RX Series |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
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搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
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为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Structural Adhesive Type | Typical State | Recommended Defoaming Method | Recommended Equipment |
| Formulation R&D / Small Samples | Small volume adhesive | Centrifugal / Vacuum Mixing & Defoaming | C Series / ZK Series |
| Acrylic Structural Adhesive | Medium Viscosity | Vacuum Mixing & Defoaming | MIX60 / MIX80 |
| Modified Epoxy Structural Adhesive | Medium to High Viscosity | Vacuum Mixing & Defoaming | MIX Series / MIX1000plus |
| High-strength Structural Adhesive Layer | High Viscosity | Vacuum Mixing + Pressurized Fine Defoaming | MIX1000plus / RX Series |
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
Metal StructureStructural bonding for metals and sheet metals |
Automotive BodyStructural bonding for vehicle bodies and battery packs |
Composite MaterialsStructural bonding for carbon fiber and composites |
Electronic Structural ComponentsBonding and fixing of electronic structural parts |
Rail TransitStructural bonding for rail vehicles |
Structural Adhesive ManufacturersR&D, production and filling of structural adhesives |
Full-range Equipment Operation Demo Videos
Measured Defoaming‑Process Performance
Measured Processing Results for Six Typical Materials
Paste Materials |
Adhesives & Powders |
Polymer Materials |
Pharmaceutical Gels |
Silver Paste Materials |
Battery Slurries |
Precautions for Use
| Precautions | Operating Instructions |
| Proportioning & Feeding | Weigh component A and component B accurately according to the ratio before mixing and defoaming. Incorrect ratio will affect curing and bonding strength. |
| Pot Life | Complete defoaming and bonding within the pot life after mixing. The adhesive will thicken and cure once expired. |
| Slow Pressure Relief | Release pressure slowly after defoaming to avoid re‑foaming and splashing of adhesive. |
| Timely Bonding | Apply adhesive and finish bonding promptly after mixing and defoaming to prevent air entrapment or thickening during standing. |
* Internal laboratory test data. Actual results vary depending on adhesive formulation and bonding process. Contact sales for real customer cases.
Customer Delivery & Application Cases
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