Resin Degasser

TEL:18925129293

Epoxy Resin Defoaming Machine


Eliminate Bubbles in Epoxy AB Adhesive After Mixing and Curing · Dense Potting Layer Without Voids, No Breakdown Under High Voltage

Simultaneous Defoaming with Vacuum & Mixing · Full Coverage from Milliliter-scale Samples to Mass Potting · Non-contact Mixing Without Altering Epoxy Ratio or Curing Performance

SIENOX epoxy resin defoaming solution covers three technical routes: centrifugal defoaming, vacuum defoaming, and vacuum mixing & defoaming. Targeting bubbles entrapped during mixing, potting and pouring of two-component epoxy AB adhesives, it delivers full-stage solutions from laboratory formula verification to mass potting, ensuring dense, uniform and reliable insulation for every batch of epoxy potting parts.

✓ CE Certification  ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)

在线留言 免费寄样测试 工程师热线:189-2512-9293

Why an Epoxy Resin Defoaming Machine Is Required

Bubbles entrapped after epoxy mixing are a critical threat to potting reliability.

Electronic & Electrical Potting Industry

Power modules, transformers, current transformers, sensors and other components are commonly potted and cast with epoxy resin. Air bubbles form voids within the epoxy potting layer, resulting in uneven insulation thickness. Bubble zones are prone to breakdown and heat generation under high voltage, which directly renders the devices scrapped.

LED & Optoelectronic Packaging Industry

LED strips, modules, driving power supplies and phosphor adhesives are mostly encapsulated with transparent or light-colored epoxy. Bubbles are highly visible inside transparent adhesive layers, directly ruining appearance and light uniformity. More importantly, poor heat dissipation at bubble sites drastically shortens LED chip service life. Properly defoamed epoxy layers are clear, uniform and thermally reliable.

Automotive Electronics Industry

Vehicle ECUs, wiring harness connectors, sensors and other parts adopt epoxy potting. Under vibration, thermal cycling and humid-heat conditions, cracks and liquid ingress tend to occur at bubble locations. Automotive-grade products impose strict requirements on epoxy potting density. Vacuum mixing defoamers match production line tact time to ensure consistent potting quality across batches.

✨ Traditional Dilemma: Manual stirring inevitably entraps air; vacuum chambers cannot fully remove bubbles from medium and high-viscosity epoxy. Even after successful defoaming, new bubbles are introduced again during pouring and transfer. What you need is not more expensive adhesive, but a vacuum mixing & defoaming solution that accomplishes mixing and bubble removal simultaneously.

Why Choose SIENOX Epoxy Defoaming Solution

SIENOX MIX series serves as the ideal defoaming equipment for epoxy potting from R&D to mass production.

Simultaneous Mixing and Defoaming

The biggest pain point in epoxy resin batching is air entrapment during stirring. SIENOX MIX series vacuum mixing defoamers blend epoxy resin and curing agent under vacuum. Bubbles generated by stirring are extracted at the same time. Mixing and defoaming are completed in one single process. There is no need to stir first, transfer materials and then perform defoaming. It improves efficiency and prevents new bubbles brought in during secondary transfer.

Full-stage Coverage

C series centrifugal defoamers (0–12 mL) are used for laboratory small sample validation, achieving efficient defoaming even for epoxy samples of only a few milliliters. ZK vacuum defoamers (50–500 mL) are adopted for pilot scale-up. MIX series vacuum mixing defoamers (50 mL–20 L) are available for mass production. Process parameters can be scaled smoothly from formula development to mass potting.

For Thin to Paste-like Adhesives

SIENOX equipment series covers the full viscosity range, from low-viscosity free-flowing epoxy (suitable for centrifugal defoaming) to medium & high-viscosity thermal conductive epoxy potting compound (paste type requiring vacuum mixing & defoaming). Different defoaming methods are matched for different viscosities to guarantee thorough bubble removal.

✨ The MIX60 integrates three core capabilities: deep vacuum defoaming, precision small sample processing, and reproducible process parameters. It is an ideal device for laboratory R&D requiring vacuum-assisted defoaming.

Equipment Supporting Description

SIENOX A/B adhesive defoaming solution can be combined with other equipment to form a complete potting process chain.

Equipment Supporting Process Chain 

Integrated Mixing & Defoaming: MIX Series mixes A/B adhesives and defoams synchronously under vacuum. 

Temperature-controlled Defoaming: Heat high-viscosity epoxy to reduce viscosity (40–60℃) before defoaming for higher efficiency. 

Defoaming & Potting Linkage: Cast directly after defoaming to minimize air entrapment during transfer. 

Pressurized Fine Defoaming: For components with high reliability requirements, transfer to RX for secondary pressurized fine defoaming after primary defoaming.

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Specifications & Parameters

Selection Guide

Epoxy Resin TypeTypical ViscosityRecommended Defoaming MethodRecommended Equipment
Low-viscosity Epoxy Potting Compound500-3000cPCentrifugal Defoaming / Vacuum DefoamingC Series / ZK Series
Medium-viscosity Epoxy Potting Compound3000-15000cPVacuum Defoaming / Vacuum Mixing & DefoamingZK Series / MIX Series
High-viscosity Thermal Conductive Epoxy15000-80000cPVacuum Mixing & DefoamingMIX Series
Paste-like Thermal Conductive Epoxy>80000cPVacuum Mixing & Defoaming + Pressurized DefoamingMIX Series / RX Series
Transparent Epoxy Potting Compound800-5000cPVacuum Defoaming / Vacuum Mixing & DefoamingZK Series / MIX Series
High-temperature Resistant EpoxyMedium-High ViscosityVacuum Mixing & DefoamingMIX Series

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深受全球知名工业制造集群及前沿高校实验室信赖

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FAQ 您关心的问题

为您解答关于产品性能及日常工艺选型中的常见疑问

  • 真空脱泡搅拌机是什么?用于哪些行业?

    真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。

  • 广州施诺斯主要生产哪些设备?

    主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。

  • 源头厂家采购脱泡设备有什么优势?

    源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。

  • 搅拌脱泡机的工作原理?

    施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。

  • 为什么选择施诺斯?

    施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

Epoxy Resin TypeTypical ViscosityRecommended Defoaming MethodRecommended Equipment
Low-viscosity Epoxy Potting Compound500-3000cPCentrifugal Defoaming / Vacuum DefoamingC Series / ZK Series
Medium-viscosity Epoxy Potting Compound3000-15000cPVacuum Defoaming / Vacuum Mixing & DefoamingZK Series / MIX Series
High-viscosity Thermal Conductive Epoxy15000-80000cPVacuum Mixing & DefoamingMIX Series
Paste-like Thermal Conductive Epoxy>80000cPVacuum Mixing & Defoaming + Pressurized DefoamingMIX Series / RX Series
Transparent Epoxy Potting Compound800-5000cPVacuum Defoaming / Vacuum Mixing & DefoamingZK Series / MIX Series
High-temperature Resistant EpoxyMedium-High ViscosityVacuum Mixing & DefoamingMIX Series

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

Electronic Potting.jpg

Electronic Potting

Epoxy Potting & Casting for Power Modules, Transformers, Current Transformers, Sensors

LED & Optoelectronic Packaging.jpg

LED & Optoelectronic Packaging

Encapsulation for LED Strips, Modules, Driver Power Supplies, Phosphor Epoxy

Automotive Electronics.jpg

Automotive Electronics

Epoxy Potting for Vehicle ECUs, Wiring Harness Connectors, On-board Sensors

Thermal Conductive Potting.jpg

Thermal Conductive Potting

Thermal Conductive Epoxy Compounds for Power Devices, New Energy Power Supplies, Inverters

Epoxy Casting & Composites.jpg

Epoxy Casting & Composites

Insulating Cast Parts, Carbon Fiber Composites, Sports Equipment, Artwork Casting

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Structural Bonding & Anti-corrosion

Epoxy Structural Adhesives, Anti-corrosion Linings, Floor & Insulating Coatings

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

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Paste Materials

Photoresist Mixing & Defoaming.jpg

Adhesive & Powder Mixtures

Polymer Materials.jpg

Polymer Materials

Pharmaceutical Gel Defoaming 02.jpg

Pharmaceutical Gels

Silver Paste Mixing & Defoaming.jpg

Silver Paste Materials

Battery Slurry & Adhesive Mixing & Defoaming.jpg

Battery Slurries



Precautions for Use

PrecautionsOperating Instructions
Weighing & ProportioningAccurately weigh epoxy resin and curing agent according to the specified ratio before mixing and defoaming. Incorrect ratio will affect curing performance.
Stirring SpeedControl stirring speed during vacuum mixing & defoaming. Excessively fast speed may generate new vortex bubbles.
Time ControlComplete defoaming and potting within the pot life after epoxy mixing. The material will thicken and cure once the time limit is exceeded.
Vacuum DefoamingRelease pressure slowly before opening the lid after vacuum defoaming to prevent epoxy expansion and bubbling caused by rapid pressure reduction.
Temperature ControlHigh-viscosity epoxy can be heated moderately to 40–60℃ to reduce viscosity before defoaming for higher efficiency.

* Internal laboratory test data. Actual results vary with material formulation and process. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


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Stirring‑Defoaming Solution for Glue Materials in Consumer‑Electronics Industry


施诺斯真空脱泡搅拌机在胶粘剂中的解决方案.jpg

Vacuum Defoaming Solution for Consumer Electronics Adhesives


涂膜材料01.jpg

Industrial University Solves Bubble Challenges of Coating‑Film Materials with SIENOX Defoaming Machine

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