Planetary Mixing Defoamer
TEL:18925129293
SIENOX Planetary Mixing‑Defoaming Machine SIE‑CV1000
1000mL Large‑Capacity Planetary Mixing · One‑Step Solution for Pilot‑Scale Production
0‑2000rpm Stepless Speed + Optional Vacuum / Temperature Control / MES, Flexible for Production Processes
SIENOX SIE‑CV1000 is a planetary mixing‑defoaming machine designed for pilot‑scale validation and small‑batch production. Its 1000 mL large capacity meets transition requirements from lab R&D to production launch. Adopting synchronous dual‑power revolution‑rotation technology: revolution generates strong centrifugal force for full‑range material convection, while rotation delivers directional shear force for thorough high‑efficiency mixing. Centrifugal force removes bubbles simultaneously, finishing mixing and defoaming in one step.
Optional modules: vacuum module (-98kPa), heating / cooling temperature control, and MES networking system for custom configurations. 304 stainless‑steel frame with imported core components, 153 kg heavy‑duty chassis for stable and reliable long‑term batch operation.
✓ CE Certified ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage Available (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles in materials directly affect the yield and performance of end‑products.
Electronic Component ManufacturingMicro‑bubbles in solder paste for SMT processes cause voids and cold solder joints, reducing soldering reliability. Bubble expansion during reflow soldering leads to spattering and bridging. Excessive voids in precision components trigger failures under thermal cycling and lower overall board yield. | Medical Device ManufacturingBubbles in medical silicone and bio‑glue compromise dosage accuracy and consistency, risking dosing deviation. Bubbles in ointment gels cause uneven filling and inconsistent net content. For implant‑grade materials, tiny bubbles may bring biocompatibility risks. | 3D‑Printing ManufacturingMicro‑bubbles in photosensitive resin create layer defects and degrade mechanical strength & surface finish. In large‑volume printing, bubbles produce visible streaks and pits on cured surfaces. Bubbles in metal powder slurry raise porosity of sintered parts and reduce final density. |
✨ Limitations of conventional methods: Manual stirring or standard impeller mixing draws in air, generating more bubbles during agitation. Static degassing takes long hours with limited performance. Therefore, a non‑contact planetary mixing‑defoaming solution is required, which separates bubbles via centrifugal force while mixing materials.
Why Choose SIE‑CV1000
Three Core Advantages Cover the Entire Pilot Production Process
Large‑Capacity Production1000 mL processing capacity meets pilot‑scale up‑scaling and small‑batch production requirements per cycle. Dual‑cup design enables simultaneous processing of two materials or doubled throughput to boost production‑line efficiency. 2000 rpm with fixed speed ratio ensures consistency and repeatability for batch processing. | Modular ExpansionOptional modules including vacuum (-98 kPa), heating/cooling temperature control and MES networking system for flexible configuration according to process requirements. One unit covers multiple scenarios from pilot validation to production launch and reduces redundant equipment investment. Temperature‑control module suits heat‑sensitive and high‑viscosity materials; vacuum module improves micro‑bubble removal performance. | Reliable & DurableRobust unit with stainless‑steel frame; optimized transmission reduces vibration and noise. Balance sensor corrects running eccentricity in real‑time for stable long‑term batch operation. Imported core components deliver high durability, lowering maintenance frequency and operating costs. |
✨ The SIE‑CV1000 integrates three core capabilities: large‑capacity processing, modular expansion and stable operation. It is the ideal equipment from pilot‑scale validation to small‑batch production.
Working Principle
Synchronous revolution‑rotation operation; optional vacuum module enhances defoaming performance.
Step 1: Centrifugal force from revolution Step 2: Shear force from rotation Revolution and rotation run simultaneously. Materials complete the full cycle of "Mixing → Dispersion → Defoaming" inside the sealed container. Constant speed ratio maintained by gear transmission guarantees consistency and repeatability of test data across batches. | ![]() |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE-CV1000 |
| Mixing Capacity | 0–1000 mL (standard vessel) * Customizable |
| Vessel Type | Test tube / jar / cup; adapters for syringes & cartridges available |
| Quantity of Vessels | 1 or 2 jars (user selectable) |
| Max Rotation Speed | 0 – 2000 RPM (stepless adjustable) |
| Revolution / Rotation Ratio | Fixed planetary ratio |
| Vacuum Level | Optional: –98kPa |
| Control System | Touch screen, stores up to 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/Japan standard customizable) |
| Overall Dimension(W×D×H) | 610 × 560 × 780 mm |
| Net Weight | 153 kg |
| Certifications | CE, ISO9001, RoHS Compliance |
我们的合作伙伴
深受全球知名工业制造集群及前沿高校实验室信赖
FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
-
真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
-
广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
-
源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
-
搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
-
为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Multi‑Model Specification Comparison Table
Compare Models in the Same Series for Accurate Selection
| Model | SIE-CV300 | SIE-CV1000 | SIE-CV1000 |
| Mixing Capacity | 0–300 mL (standard vessel) * Customizable | 0–1000 mL (standard vessel) * Customizable | 0–1000 mL (standard vessel) * Customizable |
| Vessel Type | Test tube / jar / cup; adapters for syringes & cartridges available | Test tube / jar / cup; adapters for syringes & cartridges available | Test tube / jar / cup; adapters for syringes & cartridges available |
| Quantity of Vessels | 1 or 2 jars (user selectable) | 1 or 2 jars (user selectable) | 1 or 2 jars (user selectable) |
| Max Rotation Speed | 0 – 3000 RPM (stepless adjustable) | 0 – 2000 RPM (stepless adjustable) | 0 – 2500 RPM (stepless adjustable) |
| Revolution / Rotation Ratio | Fixed planetary ratio | Fixed planetary ratio | Freely adjustable |
| Vacuum Level | Optional: –98kPa | Optional: –98kPa | Optional: –98kPa |
| Control System | Touch screen, stores up to 100 recipe sets | Touch screen, stores up to 100 recipe sets | Touch screen, stores up to 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/Japan standard customizable) | 220V, 50/60Hz (110V US/Japan standard customizable) | 220V, 50/60Hz (110V US/Japan standard customizable) |
| Overall Dimension(W×D×H) | 510 × 430 × 500 mm | 610 × 560 × 780 mm | 610 × 560 × 780 mm |
| Net Weight | 95 kg | 153 kg | 163 kg |
| Certifications | CE | CE | CE |
*** The above are typical models only. Customized solutions are available to meet customer requirements.
Multi‑Industry Solutions
Covers Mixing & Defoaming Applications for Typical Materials in Six Major Industries
SMT Electronic ManufacturingSolder paste, red adhesive, flux, underfill, die attach adhesive |
PV ManufacturingSilver paste, aluminum paste, EVA film adhesive, silicone sealant, conductive adhesive |
Automotive ManufacturingStructural adhesive, sealant, thermal conductive silicone, primer, anaerobic adhesive |
Printing & PackagingUV ink, water-based ink, varnish, laminating adhesive, screen printing ink |
Cosmetics & Daily ChemicalsLotion, cream, gel, foundation, sunscreen |
Ceramic ProcessingAlumina slurry, zirconia slurry, ceramic glaze, electronic ceramic slurry, ceramic binder |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry & Powder |
Adhesive |
Hydrogen Energy Materials |
Adhesive |
Base Material & Filler |
Adhesive & Ceramic Powder |
Actual‑test Effect Comparison
Material Before‑and‑after Degassing Comparison
| Material Type | State Before Treatment | After Treatment by CV1000 |
| Solder Paste | Micro bubbles throughout paste, uneven tin powder distribution, prone to tailing and bridging during printing | Smooth and dense paste, uniformly dispersed tin powder, clean release during printing, full solder joints without voids |
| Conductive Silver Paste | Severe silver powder agglomeration, turbid colloid with bubbles, discontinuous conductive paths | Evenly distributed silver powder, transparent and dense colloid, stable conductivity, qualified bonding strength |
| Ink | Uneven pigment dispersion, residual particles and bubbles, inconsistent printing color shade | Uniform pigment dispersion, no particles or bubbles, consistent printing color, good adhesion |
* Internal laboratory test data. Actual improvement varies with material formulation. Contact sales for real customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.
Stirring & Defoaming Solution for Powders and Fluids | AB Structural Adhesive Mixing & Defoaming Solution | High-Viscosity Colloid & Phosphor Material Mixing and Defoaming Solution |















