Temperature-Controlled Degasser
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Temperature‑controlled Vacuum Mixer‑Defoamer SIE‑MIX5000WK
5L Large‑capacity Temperature‑controlled Mass‑production Platform · Nano‑level Deep Vacuum‑temperature‑controlled Defoaming
5000mL Large‑capacity Dual Cups + Ambient‑range Heating/Cooling Temperature Control + ‑98kPa Deep Vacuum Defoaming
SIENOX SIE‑MIX5000WK is a temperature‑controlled vacuum mixer‑defoamer engineered for large‑batch production of temperature‑sensitive materials. Dual 5000 mL cups meet continuous inline processing demands. Dual‑mode temperature control precisely regulates material temperature. ‑98kPa vacuum defoaming works with dual‑power planetary mixing to finish mixing and defoaming in one single cycle.
✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Customizable Voltage (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Micro/nano residual bubbles in materials directly affect product yield and performance stability.
New Energy IndustryBubbles in lithium‑battery slurries impair coating uniformity and degrade consistency of battery capacity and cycle life. Bubbles in PV EVA films trigger lamination defects and delamination risks. Heat generated during new‑energy slurry mixing alters rheological properties. Temperature‑controlled defoaming stabilizes temperature window to guarantee coating quality. | Semiconductor IndustryBubbles in semiconductor encapsulants create internal voids and poor heat dissipation. Bubbles inside conductive silver adhesives cause circuit open‑points and resistance fluctuation. Semiconductor materials are temperature‑sensitive; excessive heat changes curing behavior. Temperature‑controlled defoaming balances defoaming efficiency and material safety. | Adhesive IndustryBubbles in structural adhesives lead to unstable bonding strength and discontinuous load‑bearing surfaces. Bubbles in sealants result in sealing leakage. Most adhesives cure via exothermic reactions; temperature rise accelerates curing and aggravates bubble formation. Temperature‑controlled mixing‑defoaming removes bubbles while maintaining proper temperature. |
✨ Traditional defoaming bottlenecks: Manual mixing causes uneven blending and air entrapment, while conventional equipment delivers limited centrifugal force and fails to eliminate microbubbles. Without precise temperature control, ordinary devices easily trigger thermal degradation of temperature-sensitive materials via simple heating. This integrated solution adopts centrifugal mixing, negative vacuum pressure and accurate temperature control to complete mixing, temperature regulation and defoaming in one step.
Why Choose MIX5000
Three Core Features Cover Full‑process Demands of Temperature‑controlled Vacuum Defoaming
5L Large‑capacity Temp‑controlled Production PlatformEquipped with dual 5000 mL cups, 0‑1200 rpm wide‑range speed adjustment covers low‑to‑high viscosity materials. 100‑recipe storage supports multi‑product switching. 550 kg rigid frame with 304‑stainless‑steel enclosure ensures stable long‑time temperature‑controlled operation. | Nano‑level Deep Vacuum‑temperature‑controlled DefoamingStandard‑98 kPa vacuum system. Centrifugal force removes large bubbles while vacuum eliminates nano‑microbubbles. Vacuum works synchronously with temperature control: heating reduces viscosity for faster bubble release; vacuum compensates low‑temperature defoaming efficiency loss for consistent results. | Precise Temperature Control Across Multiple Speed RangesSelectable fixed/adjustable planetary speed ratio. Fixed ratio guarantees production consistency; adjustable mode fits R‑D trials. Dual‑mode heating‑cooling reduces viscosity by heating and suppresses thermal degradation by cooling. One unit handles both heated mixing and low‑temperature defoaming processes. |
✨ MIX5000WK suits large‑capacity temperature‑controlled production and vacuum defoaming for temp‑sensitive materials including new energy, semiconductors, adhesives and advanced materials.
Working Principle
Adopts coordinated process of planetary revolution, container rotation, sealed vacuum defoaming and temperature control to realize one‑step mixing, temperature regulation and defoaming.
Planetary Revolution Centrifugal force generated by main‑plate revolution spreads materials toward vessel wall, breaks powder agglomerates and mitigates stratification. The temperature‑control system runs simultaneously to keep materials within target temperature range. Vessel Rotation Reverse vessel rotation creates 360° fluid turbulence for full‑range homogeneous mixing. No impeller contact avoids material contamination. Optional fixed/adjustable revolution‑rotation ratio adapts to various‑viscosity materials. Sealed Vacuum Defoaming Sealed chamber pulls negative pressure to ‑98 kPa. Pressure difference expands micro‑/nano‑bubbles for floating‑out removal. Mixing and defoaming are accomplished within one single process segment. Precise Temperature Control for Material Status Temperature control runs through the whole mixing‑defoaming cycle: heating reduces viscosity for better fluidity and faster bubble release; cooling suppresses thermal degradation and manages exothermic reactions. Temperature regulation works inline without separate thermal‑control steps. Coordinated planetary revolution, vessel rotation, sealed vacuum defoaming and dual‑mode temperature control complete the full workflow: mixing → dispersion → vacuum defoaming → thermal regulation in one step. |  |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE‑MIX5000WK |
| Mixing Capacity | 0–5000 mL (standard vessel) * Customizable |
| Vessel Type | Tubes / Jars / Cups; adapters for syringes & cartridges available |
| Vessel Quantity | 1 or 2 jars (optional) |
| Max Speed | 0‑1200 RPM (stepless adjustable) |
| Temperature Mode | Cooling / Heating |
| Vacuum Level | Standard:‑98 kPa / Optional:‑100 kPa |
| Control System | Touch screen, stores 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension(W×D×H) | 1370 × 1130 × 965 mm |
| Net Weight | 550 kg |
| Certifications | CE, ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么？用于哪些行业？
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备，脱泡同时混料，避免二次气泡混入，常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理，广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备？
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势？
源头厂家直供可省去中间环节，价格更透明，同时能提供参数定制、来料试机、工艺验证等服务，售后响应更直接。
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搅拌脱泡机的工作原理？
施诺斯设备采用行星式混合原理：料罐在自转的同时绕公转轴公转，物料在罐内随之翻动混合，同时抽真空脱泡。整个过程设备不设搅拌桨，搅拌部件不接触物料，不会引入金属异物，混合均匀不分层。
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为什么选择施诺斯？
施诺斯（SIENOX）是广州施诺斯科技股份有限公司旗下品牌，2014 年成立，专注脱泡机与搅拌机的研发与制造，团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计，不设搅拌桨，行星式公转加自转运动辅以真空系统，高效除泡，混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材，广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证，拥有 30 余项专利，服务富士康、比亚迪、清华大学等企业与科研院所。
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Model | SIE‑MIX2000WK | SIE‑MIX5000WK | SIE‑MIX15LWK |
| Mixing Capacity | 0‑2000 mL (standard vessel) * Customizable | 0‑5000 mL (standard vessel) * Customizable | 0‑15L (standard vessel) * Customizable |
| Vessel Type | Tubes / Jars / Cups; adapters for syringes & cartridges available | Tubes / Jars / Cups; adapters for syringes & cartridges available | Tubes / Jars / Cups; adapters for syringes & cartridges available |
| Vessel Quantity | 1 or 2 jars (optional) | 1 or 2 jars (optional) | 1 or 2 jars (optional) |
| Max Speed | 0‑2000 RPM (stepless adjustable) | 0‑1200 RPM (stepless adjustable) | 100‑600 RPM (stepless adjustable) |
| Temperature Mode | Cooling / Heating | Cooling / Heating | Cooling / Heating |
| Vacuum Level | Standard:‑98 kPa / Optional:‑100 kPa | Standard:‑98 kPa / Optional:‑100 kPa | Standard:‑98 kPa / Optional:‑100 kPa |
| Control System | Touch screen, stores 100 recipe sets | Touch screen, stores 100 recipe sets | Touch screen, stores 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension(W×D×H) | 1100 × 780 × 880 mm | 1370 ×1130 × 965 mm | 1735 × 1560 × 965 mm |
| Net Weight | 225 kg | 550 kg | 830 kg |
***Above are typical models, customized solutions available upon customer requirements.
Multi‑Industry Solutions
Provide customized solutions to meet comprehensive demands from cutting‑edge R&D to large‑scale mass production
Lithium‑battery IndustryLithium‑battery cathode slurry, anode slurry, electrolyte, diaphragm coating liquid, conductive slurry |
PV & Energy Storage IndustryPV EVA film, energy‑storage electrode slurry, fuel‑cell catalyst‑layer slurry, proton‑exchange‑membrane slurry |
Encapsulation Material IndustrySemiconductor encapsulant, LED phosphor powder, insulating black glue, molding compound, underfill adhesive |
Conductive Material IndustryConductive silver adhesive, conductive silver paste, gold paste, electronic solder paste, conductive ceramic slurry |
Adhesive IndustryStructural adhesive, epoxy sealant, silicone sealant, hot‑melt adhesive, polyurethane adhesive |
Advanced‑material IndustryResin intermediate, catalyst slurry, functional coating liquid, ceramic slurry, nano‑composite material |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Measured Defoaming‑Process Performance
Thoroughly eliminate material bubbles, voids and stratification
High‑viscosity Resin |
Optoelectronic Epoxy Resin |
Biogel |
High‑viscosity Adhesive |
Silver Paste |
Structural Adhesive |
Measured Data Comparison
Quantifiable Effects Validated by Test Data
| Material Type | Pre‑treatment Status | After MIX5000WK Treatment |
| Lithium‑battery Cathode Slurry | Heavy internal bubbles, ~6% coating pinhole rate, large thickness deviation | Bubbles removed, low pinhole rate, uniform coating thickness |
| Semiconductor Encapsulant | Dense internal bubbles, ~5% encapsulation void rate, unstable heat dissipation | Bubbles removed, low void rate, stable heat dissipation |
| Epoxy Structural Adhesive | Dense internal bubbles, ±25% bonding‑strength deviation, voids on load‑bearing surface | Bubbles removed, ±5% bonding‑strength deviation, continuous load‑bearing surface |
* Internal lab test data. Actual improvement varies with material formulation. Contact sales for real‑world customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.
