Temperature-Controlled Degasser
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Temperature‑Controlled Vacuum Mixer‑Defoamer SIE‑MIX650WK
Built‑in Synergistic Vacuum & Temperature‑controlled Defoaming · 500‑mL Medium Capacity with Wide‑range Speed Regulation
500mL Medium‑capacity Dual‑cup · Maintenance‑free Built‑in Vacuum · Ambient‑heating & Cooling Temperature Control
SINOS SIE‑MIX650WK is a temperature‑controlled vacuum mixing‑defoaming machine developed for pilot‑scale R&D of temperature‑sensitive materials, featuring 500 mL medium‑capacity dual‑cup configuration. Adopting maintenance‑free built‑in vacuum, heating/cooling temperature control and revolution‑rotation dual‑power mixing, it completes mixing, temperature regulation and defoaming in one single step.
✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Customizable Voltage (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual microbubbles in materials directly affect the yield and performance stability of end‑products.
Electronics IndustryBubbles in electronic encapsulation adhesives, conductive silver pastes and laminating adhesives cause encapsulation cavities, circuit breaks and lamination defects, impairing heat dissipation, insulation and product yield. Most electronic encapsulation adhesives are medium‑high viscosity materials. Heating reduces viscosity and improves flowability, yet excessive temperature will change curing properties. Temperature‑controlled defoaming is key to balance efficiency and material safety. | Polyurethane IndustryBubbles in polyurethane casting compounds, foaming slurries and elastomer prepolymers result in post‑curing surface defects, irregular foaming structures and inconsistent elasticity. Polyurethane curing is an exothermic reaction; temperature rise accelerates reaction and worsens bubble formation. Temperature‑controlled mixing‑defoaming removes bubbles while maintaining proper material temperature. | Ink & Coating IndustryBubbles in industrial inks, coatings and UV‑curable inks bring about printing pinholes, color deviation and reduced film adhesion. Viscosity of inks and coatings varies significantly with temperature. Temperature‑controlled mixing‑defoaming completes defoaming while keeping materials within proper viscosity range. |
✨ Traditional defoaming dilemmas: manual stirring entrains air, static defoaming is time‑consuming, and ordinary vacuum only removes surface bubbles, which cannot effectively eliminate internal microbubbles. Conventional devices have no temperature‑control capability, and heating tends to degrade heat‑sensitive materials. The temperature‑controlled planetary mixing solution separates bubbles during centrifugal mixing, and with vacuum negative pressure and precise temperature control, it completes mixing, temperature control and defoaming in one step.
Why Choose SIE‑MIX650WK
Three Core Advantages Cover Full‑process Requirements for Temperature‑Controlled Vacuum Mixing‑Defoaming
Built‑in Maintenance‑free Vacuum for Synergistic Temperature‑controlled DefoamingEquipped with built‑in vacuum unit for maintenance‑free and pollution‑free operation, suitable for clean‑room applications. Adjustable vacuum from ‑98 kPa to 0 kPa works with dual‑mode temperature control. Heating lowers viscosity for easier bubble release; vacuum negative pressure compensates defoaming efficiency during cooling. Built‑in design eliminates external vacuum pump piping for plug‑and‑play operation. | 500 mL Medium Capacity with Wide‑range Speed Regulation & Temperature Control500 mL dual‑cup design with 0‑2000 rpm wide‑range speed regulation for R‑D pilot tests and production sampling, compatible with low‑, medium‑ and high‑viscosity materials. Dual‑mode temperature control delivers precise thermal adjustment during speed variation. Heating reduces viscosity and accelerates powder dispersion; cooling suppresses thermal degradation and manages exothermic reactions. One machine covers two processing scenarios. | Multi‑segment Programmable Temperature‑controlled Process EditingMicrocomputer control system stores 10 programs, each with independent multi‑segment settings for time, speed and temperature parameters. It supports operator permission management and fault indication. Program‑driven operation minimizes manual errors and ensures consistent thermal processes across batches. Preset dedicated profiles for quick recall with different materials. |
✨ MIX650WK suits pilot‑scale R&D and temperature‑controlled vacuum mixing‑defoaming for heat‑sensitive materials such as electronic encapsulants, PU casting compounds and inks & coatings.
Working Principle
Synchronized revolution‑rotation dual‑power operation realizes one‑step mixing and defoaming.
Step 1: Centrifugal Force Generated by Revolution High‑speed revolution generates centrifugal force to drive full‑range material convection for macro‑mixing, meanwhile pushing bubbles toward the axis for escape. The temperature‑control system runs simultaneously to keep materials within target temperature range. Step 2: Shear Force from Rotation Container rotation produces shear force to break agglomerated particles for micro‑dispersion. Fixed speed ratio ensures uniform high‑efficiency mixing. Shear force thins bubble membranes to accelerate bubble rupture. No stirring paddles contact materials to lower contamination risks. Step 3: Deep Defoaming via Vacuum Negative Pressure The built‑in vacuum unit creates negative‑pressure environment, reducing pressure difference to expand and release deep‑seated microbubbles. Adjustable vacuum from ‑98 kPa to 0 kPa adapts to materials of various viscosities with maintenance‑free and pollution‑free operation. Step 4: Precise Temperature Regulation for Material Status Materials go through the full‑cycle “mixing → dispersion → vacuum defoaming → temperature adjustment” inside sealed containers, completing temperature‑controlled vacuum mixing‑defoaming in one step. |  |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE‑MIX650WK |
| Mixing Capacity | 0‑500 mL (standard vessel) * Larger volume available upon request |
| Vessel Type | Tubes / Jars / Cups; adapters for syringes & cartridges supported |
| Vessel Quantity | 1 or 2 jars (user‑selectable) |
| Max Speed | 0‑2000 RPM (stepless adjustable) |
| Temperature Mode | Cooling / Heating |
| Vacuum Level | Standard: ‑98 kPa / Optional: ‑100 kPa |
| Control System | Touch screen, stores up to 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension (W×D×H) | 580 × 560 × 760 mm |
| Net Weight | 145 kg |
| Certifications | CE, ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么？用于哪些行业？
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备，脱泡同时混料，避免二次气泡混入，常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理，广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备？
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势？
源头厂家直供可省去中间环节，价格更透明，同时能提供参数定制、来料试机、工艺验证等服务，售后响应更直接。
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搅拌脱泡机的工作原理？
施诺斯设备采用行星式混合原理：料罐在自转的同时绕公转轴公转，物料在罐内随之翻动混合，同时抽真空脱泡。整个过程设备不设搅拌桨，搅拌部件不接触物料，不会引入金属异物，混合均匀不分层。
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为什么选择施诺斯？
施诺斯（SIENOX）是广州施诺斯科技股份有限公司旗下品牌，2014 年成立，专注脱泡机与搅拌机的研发与制造，团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计，不设搅拌桨，行星式公转加自转运动辅以真空系统，高效除泡，混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材，广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证，拥有 30 余项专利，服务富士康、比亚迪、清华大学等企业与科研院所。
Technical Specification List
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Model | SIE‑MIX60ZK | SIE‑MIX650ZK | SIE‑MIX90ZK |
| Mixing Capacity | 0‑300 mL (standard vessel) * Customizable | 0‑500 mL (standard vessel) * Customizable | 0‑1000 mL (standard vessel) * Customizable |
| Vessel Type | Tubes / Jars / Cups; adapters for syringes & cartridges supported | Tubes / Jars / Cups; adapters for syringes & cartridges supported | Tubes / Jars / Cups; adapters for syringes & cartridges supported |
| Vessel Quantity | 1 or 2 jars (user‑selectable) | 1 or 2 jars (user‑selectable) | 1 or 2 jars (user‑selectable) |
| Max Speed | 0‑3000 RPM (stepless adjustable) | 0‑2000 RPM (stepless adjustable) | 0‑2000 RPM (stepless adjustable) |
| Temperature Mode | Cooling / Heating | Cooling / Heating | Cooling / Heating |
| Vacuum Level | Standard: ‑98 kPa / Optional: ‑100 kPa | Standard: ‑98 kPa / Optional: ‑100 kPa | Standard: ‑98 kPa / Optional: ‑100 kPa |
| Control System | Touch screen, stores up to 100 recipe sets | Touch screen, stores up to 100 recipe sets | Touch screen, stores up to 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) |
| Dimension (W×D×H) | 510 × 430 × 500 mm | 580 × 560 × 760 mm | 610 × 560 × 780 mm |
| Net Weight | 95 kg | 145 kg | 153 kg |
*** The above are typical models only. Customized solutions are available according to customer‑specific requirements.
Multi‑Industry Solutions
Provide customized solutions to meet comprehensive demands from cutting‑edge R&D to large‑scale mass production
Battery IndustryLithium‑ion cathode slurry, anode slurry, electrolyte, separator coating liquid, conductive paste |
Chemical IndustryResin solution, reactive adhesive, catalyst slurry, functional coating liquid |
Medical Device IndustryMedical adhesive, sensor encapsulant, catheter coating liquid, diagnostic reagent carrier |
3D Printing IndustryPhotosensitive resin, functional ink, ceramic slurry, composite prepreg |
Adhesive & Sealant IndustryStructural adhesive, sealant, conductive adhesive, high‑temperature adhesive |
Silicone IndustryThermal conductive grease, silicone mixture, silicone resin, silane coupling agent |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Measured Defoaming‑Process Performance
Thoroughly eliminate material bubbles, voids and stratification
Photoresist |
Epoxy Coating |
Polymer Materials |
Hydrogen‑energy Materials |
Silver Paste Materials |
Battery Slurry |
Measured Data Comparison
Quantifiable Effects Validated by Test Data
| Material Type | Status Before Treatment | After MIX650ZK Treatment |
| Epoxy Potting Adhesive | Dense internal bubbles, approx. 5% encapsulation cavity rate, unstable insulation performance | Bubbles eliminated, zero encapsulation cavity rate, stable insulation performance |
| Polyurethane Casting Compound | Abundant internal bubbles, approx. 8% cured‑surface defect rate, fluctuating mechanical properties | Bubbles eliminated, low surface defect rate, stable mechanical properties |
| UV‑curable Ink | Plenty of internal bubbles, approx. 7% printing pinhole rate, obvious color deviation | Bubbles eliminated, low pinhole rate, color deviation removed |
* Internal laboratory test data. Actual improvement varies with material formulations. Contact sales for real‑world customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.
