Adhesive Degasser

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AB Glue Defoaming Machine


Solve Bubble Difficulties of Two‑Component AB Glue After Mixing · Dense Potting Layer Without Voids

Two‑component mixing & defoaming integration + Dual defoaming by stirring and vacuum + Full coverage from laboratory to mass production

SIENOX AB‑glue defoaming solutions cover three technical routes: centrifugal defoaming, vacuum defoaming, and stirring‑vacuum defoaming. It provides full‑phase solutions from laboratory R&D to mass production for bubble issues of mixed two‑component AB glue. From several‑milliliter formula verification to dozens‑of‑liter batch potting, every batch of AB‑glue potting products achieves bubble‑free dense structure.

✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom voltage available (110V/220V)

在线留言 免费寄样测试 工程师热线:189-2512-9293

Why Do You Need an AB Glue Defoaming Machine?

Bubbles entrapped during mixing greatly impair potting quality

Electronic Component Potting Industry

Electronic components such as power modules, transformers and sensors are commonly protected by epoxy AB‑glue potting. Bubbles form voids inside potting layers, causing uneven electrical insulation. Breakdown tends to occur at bubble positions under high‑voltage conditions, resulting in direct component scrapping.

 LED Lighting Industry
              

Transparent or white AB glue is widely used for potting LED strips, modules and driving power supplies. Bubbles are highly visible in transparent glue layers, directly damaging appearance and light‑efficiency uniformity. Worse still, poor heat dissipation at bubble positions drastically shortens LED bead service life. Properly debubbled potting layers deliver uniform transparency, consistent luminous efficiency and reliable heat dissipation.

Automotive Electronics Industry 

 Potting requirements are stricter for vehicle‑mounted ECUs, wire‑harness connectors, sensors and other parts. Cracks and liquid ingress easily emerge around bubbles under vibration, temperature cycling and humid‑hot conditions. Automotive‑grade products demand strict potting compactness for every unit in mass production. Stirring‑vacuum defoaming machines match production‑line tact time to guarantee consistent potting quality for each batch.        

✨ Traditional Dilemma: After manual stirring of AB glue, pour it into a container and let it stand for half an hour. Though no bubbles appear on the surface, numerous tiny holes turn up once the potted part is cured and cut open. Bubbles inside high‑viscosity AB glue cannot escape merely by vacuum chamber pumping. Even if defoaming is finished, new bubbles get entrapped again during potting. What you need is not more expensive glue, but a stirring‑vacuum defoaming solution that completes mixing and defoaming simultaneously.

Why Choose SIENOX AB‑Glue Defoaming Solution

Solve Core Challenges of AB‑Glue Mixing and Defoaming

Simultaneous Mixing and Defoaming

The biggest pain point of AB glue is bubbles entrapped during mixing. SIENOX MIX‑series stirring‑vacuum defoaming machines blend A and B glue under vacuum atmosphere. Bubbles generated during stirring are extracted synchronously under vacuum. Mixing and defoaming are accomplished in one single process, eliminating separate steps of stirring, material transfer and defoaming. It improves efficiency and prevents new bubbles caused by secondary material transfer.

Full‑phase Application Coverage

C‑series centrifugal defoaming machines (0‑12mL) for lab small‑sample verification for efficient defoaming of several‑milliliter AB‑glue samples; ZK‑series vacuum defoaming machines (50‑500mL) for pilot scale‑up; MIX‑series stirring‑vacuum defoaming machines (50mL‑20L) for mass production. Process parameters can be smoothly scaled up from R&D formula validation to batch potting.

For Thin to Paste‑Like Adhesives

SIENOX equipment series covers full viscosity range, from low‑viscosity epoxy AB glue (good fluidity, handled by centrifugal defoaming) to medium‑high‑viscosity thermal‑conductive AB glue (paste‑type, requiring combined stirring and vacuum). Corresponding defoaming modes are matched for different viscosities to guarantee satisfactory defoaming performance.

✨ MIX15LWK meets heavy‑duty temperature‑controlled mass production and high‑viscosity defoaming demands for temperature‑sensitive materials including new energy, semiconductors, adhesives and advanced materials.

Equipment Supporting Instructions

SIENOX AB‑glue defoaming solution can cooperate with other equipment to form a complete potting process chain

SIENOX AB‑glue defoaming solution can cooperate with other equipment to form a complete potting process chain: 

Integrated stirring & defoaming: MIX‑series stirring defoaming machines mix AB glue and perform synchronous defoaming under vacuum, finishing mixing and debubbling in one procedure. 

Temperature‑controlled defoaming: WK‑series temperature‑controlled defoaming machines conduct defoaming at set temperatures. Suitable for high‑viscosity AB glue to reduce viscosity by heating for higher defoaming efficiency. 

Defoaming & dispensing linkage: Connect directly to SIE‑301/302/303 dispensing machines for potting after defoaming, reducing new bubbles introduced by intermediate transfer steps. 

Pressurized fine defoaming: For scenarios requiring high defoaming rate, perform secondary fine defoaming with RX pressurized defoaming machine after stirring‑vacuum defoaming for higher defoaming efficiency.

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Specifications

AB‑Glue Types and Equipment Selection Guide

AB‑Glue TypeTypical ViscosityRecommended Defoaming MethodRecommended Equipment
Low‑viscosity Epoxy AB Glue500‑3000cPCentrifugal Defoaming / Vacuum DefoamingC‑Series / ZK‑Series
Medium‑viscosity Epoxy AB Glue3000‑15000cPVacuum Defoaming / Vacuum Stirring‑DefoamingZK‑Series / MIX‑Series
High‑viscosity Thermal‑conductive AB Glue15000‑80000cPVacuum Stirring‑DefoamingMIX‑Series
Paste‑like Thermal‑conductive AB Glue>80000cPVacuum Stirring‑Defoaming + Pressurized DefoamingMIX‑Series / RX‑Series
Transparent Potting AB Glue800‑5000cPVacuum Defoaming / Vacuum Stirring‑DefoamingZK‑Series / MIX‑Series
High‑temperature‑resistant AB GlueMedium‑to‑high ViscosityVacuum Stirring‑DefoamingMIX‑Series

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FAQ 您关心的问题

为您解答关于产品性能及日常工艺选型中的常见疑问

  • 真空脱泡搅拌机是什么?用于哪些行业?

    真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。

  • 广州施诺斯主要生产哪些设备?

    主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。

  • 源头厂家采购脱泡设备有什么优势?

    源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。

  • 搅拌脱泡机的工作原理?

    施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。

  • 为什么选择施诺斯?

    施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

AB‑Glue TypeTypical ViscosityRecommended Defoaming MethodRecommended Equipment
Low‑viscosity Epoxy AB Glue500‑3000cPCentrifugal Defoaming / Vacuum DefoamingC‑Series / ZK‑Series
Medium‑viscosity Epoxy AB Glue3000‑15000cPVacuum Defoaming / Vacuum Stirring‑DefoamingZK‑Series / MIX‑Series
High‑viscosity Thermal‑conductive AB Glue15000‑80000cPVacuum Stirring‑DefoamingMIX‑Series
Paste‑like Thermal‑conductive AB Glue>80000cPVacuum Stirring‑Defoaming + Pressurized DefoamingMIX‑Series / RX‑Series
Transparent Potting AB Glue800‑5000cPVacuum Defoaming / Vacuum Stirring‑DefoamingZK‑Series / MIX‑Series
High‑temperature‑resistant AB GlueMedium‑to‑high ViscosityVacuum Stirring‑DefoamingMIX‑Series

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

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Adhesive R&D

Epoxy structural adhesives, sealants, hot‑melt adhesives, pressure‑sensitive adhesives, modified adhesives

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Precision Electronic Assembly

Underfill adhesives, conductive adhesives, die‑attach adhesives, dispensing adhesives, chip bonding adhesives

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Biosensors

Potting adhesives, reagent immobilization materials, microfluidic bonding adhesives, biocompatible adhesives, sensor sealants

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Microelectronic Packaging

Packaging epoxy adhesives, molding compounds, lead bonding adhesives, substrate bonding adhesives, passivation layer materials

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Functional Coatings

Hydrophobic coatings, conductive coatings, insulating coatings, anti‑corrosion coatings, wear‑resistant coatings

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Electronic Pastes

Silver paste, copper paste, carbon paste, resistor paste, dielectric paste

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

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Paste‑Like Materials

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Adhesive with Powder Fillers

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Polymer Materials

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Pharmaceutical Gels

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Silver Paste Materials

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Battery Slurries



Operating Precautions

Material Defoaming Effect Comparison Before & After

Material TypePre‑treatment Status
Silver PasteWeigh A/B components of AB glue accurately by ratio before mixing and defoaming. Incorrect ratio will impair curing performance.
Stirring SpeedControl stirring speed during vacuum stirring‑defoaming. Excessively high speed may generate new vortex bubbles.
Time ControlComplete defoaming and dispensing within pot‑life after AB‑glue mixing. Adhesive will thicken and cure beyond time limit.
Vacuum DefoamingRelease pressure slowly after vacuum defoaming to prevent adhesive foaming caused by rapid decompression.
Temperature ControlFor higher efficiency, heat high‑viscosity AB glue to 40‑60℃ properly to reduce viscosity before defoaming.

* Internal lab test data. Actual improvement varies with material formula. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


真空脱泡搅拌机:彻底解决UV胶固化难题01.jpg

Stirring‑Defoaming Solution for Glue Materials in Consumer‑Electronics Industry


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Vacuum Defoaming Solution for Consumer Electronics Adhesives


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Industrial University Solves Bubble Challenges of Coating‑Film Materials with SIENOX Defoaming Machine

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