Dispensing Machine

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SIENOX Automatic Dispenser SIE‑301


Four‑axis Linked Multi‑dimensional Dispensing for Precision Dispensing of Small Electronic Parts

Precision Dispensing for Small Parts + ±0.02mm Accuracy + Cost‑effective Entry‑level Model

SIENOX SIE‑301 automatic dispenser adopts four‑axis linkage for precise glue control. Working travel: 400×400×100mm, repeat accuracy ±0.02mm, max load 10kg. It supports programming via teach pendant and CAD import, compatible with UV glue, red glue, solder paste and other fluids for precision dispensing of small electronic components.

✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Customizable Voltage (110V/220V)

在线留言 免费寄样测试 工程师热线:189-2512-9293

Why is precision dispensing required

Manual dispensing relies on operator experience, resulting in unstable glue volume, common issues such as glue accumulation, missing dispensing and stringing, and low yield consistency.

Higher Precision Requirements for Electronic Manufacturing

Processes such as PCB dispensing, component fixing and SMT patch glue repair require dispensing accuracy up to millimeter or even micron level. Manual dispensing cannot guarantee consistent glue volume, which may cause glue overflow contaminating pads or insufficient glue resulting in poor bonding. SIE‑301 delivers repeat accuracy of ±0.02mm to ensure consistent dispensing position and glue volume. Compatible with electronic‑grade materials including UV glue, red glue and solder paste, it improves yield of PCB dispensing.

Miniaturization Challenges for Semiconductor Packaging

Semiconductor processes such as chip underfill, lead packaging and conductive connection impose strict requirements on dispensing accuracy and glue volume control. Small‑sized chips and limited dispensing space may cause packaging defects with slight deviations. SIE‑301 with 400×400mm working travel fits chip‑scale packaging. ±0.02mm repeat accuracy ensures precise micron‑level dispensing position, compatible with packaging materials like epoxy adhesive, silver adhesive and conductive adhesive.

Precision Bonding Demands for Medical Devices

Medical devices feature compact size and high‑precision requirements, such as micro‑component bonding, needle dispensing and catheter coating. UV glue and medical‑grade adhesives shall be applied accurately at target positions. Excessive glue impairs product functions while insufficient glue reduces bonding strength. The single‑head precise positioning mode of SIE‑301 suits micro‑component dispensing. ±0.02mm accuracy guarantees consistent dispensing quality for medical devices.

✨ Dilemmas of traditional dispensing: Manual dispensing features low efficiency, poor consistency and unstable yield; semi‑automatic dispensers only support planar dispensing and cannot handle 3D curved surfaces; ordinary dispensers require complicated programming and long change‑over time, not suitable for multi‑variety small‑batch production.

Why Choose SIE‑301

Solve Pain Points of Model Selection for Precision Dispensing of Small‑sized Products

400×400mm Precision Working Travel

Working travel designed for small‑sized products, 400×400×100mm covers typical small‑size products such as PCB boards, chip packages and micro‑components. Well‑matched travel delivers higher positioning accuracy without sacrificing dispensing precision for small parts due to excessive working range. Max load 10kg, compatible with most small‑size workpieces and fixtures. Timing‑belt plus linear‑guide drive, moving speed 0.1‑500mm/s, balancing efficiency and stability.

Stable Quality with Single‑head Precise Glue Control

Single‑head dispensing mode focuses on high precision. Equipped with glue delay and advance glue‑off functions to precisely control glue output timing and volume for fluids of different viscosities. Uniform dispensed surface effectively avoids glue accumulation and dead glue. Precise positioning and accurate glue control prevent stringing, glue leakage and dripping. ±0.02mm repeat positioning accuracy ensures consistent dispensing quality for every small‑size product.

Cost‑effective Entry‑level with Fast ROI

SIE‑301 is positioned as entry‑level precision model. It lowers investment threshold with economical price while maintaining ±0.02mm accuracy and four‑axis linkage capability. Suitable for start‑ups, laboratory R&D and small‑batch production lines. Compact footprint, installable on desktop or workbench without extra workshop space. Fast return on investment, ideal starter equipment for automated dispensing.

✨ If you mainly dispense for small‑size products (PCB boards, chips, micro‑components) and pursue precise quality with cost‑effective entry‑level performance, SIE‑301 is your ideal choice.

Product Features

Based on planetary motion principle

Four‑axis Linked Multi‑dimensional Motion

Four‑axis linkage design supports front‑back, left‑right movement as well as dispensing on 3D inclined and curved surfaces. It can perform rapid dot dispensing, line drawing, circle drawing and dispensing / coating / spraying of various irregular patterns on product surfaces, outer walls, vertical planes and gaps. 

Precise Glue Control System 

Equipped with glue delay and advance glue‑off functions to precisely control glue output timing and volume. Uniform dispensing surface effectively avoids glue accumulation, dead glue, stringing, leakage and dripping. Repeat positioning accuracy: ±0.02mm. 

Dual‑mode Programming 

Supports on‑site programming via teach pendant and PC‑based programming with CAD / CORELDRAW. Programs can be saved and recalled for quick product changeover, suitable for multi‑variety small‑batch production. 

Timing‑belt & Linear‑guide Transmission 

Adopts timing‑belt plus linear‑guide transmission. Travel speed adjustable from 0.1 to 500mm/s, balancing high‑speed efficiency and motion stability. 

Three Working Modes 

Three working modes: dot dispensing, spray dispensing and coating to meet diverse process requirements. Controlled via hand‑held controller or PC for flexible operation. 

Wide Compatibility for Liquids 

Compatible with various solvents, adhesives, paints and chemical materials, including dozens of industrial fluids such as UV glue, red glue, solder paste, silver glue, epoxy glue, instant glue and sealant.

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Quick View of Technical Specifications

Complete Technical Specifications Overview, Customizable on Demand

Equipment ModelSIE‑301
Working Travel400×400×100
Control ModeHand Controller / PC
Nozzle ConfigurationSingle‑head
Working ModesDot Dispensing / Spray Dispensing / Coating
Glue Delay FunctionYes
Advance Glue‑off FunctionYes
Max Load (kg)10
Moving Speed (mm/s)0.1~500
Repeat Accuracy (mm)±0.02
Overall Dimension(W×D×H)500×600×500mm

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FAQ 您关心的问题

为您解答关于产品性能及日常工艺选型中的常见疑问

  • 真空脱泡搅拌机是什么?用于哪些行业?

    真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。

  • 广州施诺斯主要生产哪些设备?

    主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。

  • 源头厂家采购脱泡设备有什么优势?

    源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。

  • 搅拌脱泡机的工作原理?

    施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。

  • 为什么选择施诺斯?

    施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。

Technical Specification List

Full‑line standardized specifications for accurate process evaluation and equipment selection

Equipment ModelSIE‑301SIE‑302SIE‑303
Working Travel400×400×100600×600×1001000×1000×200
Control ModeHand Controller / PCHand Controller / PCHand Controller / PC
Nozzle ConfigurationSingle‑headSingle‑head / Multi‑headSingle‑head / Multi‑head
Working ModesDot Dispensing / Spray Dispensing / CoatingDot Dispensing / Spray Dispensing / CoatingDot Dispensing / Spray Dispensing / Coating
Glue Delay FunctionYesYesYes
Advance Glue‑off FunctionYesYesYes
Max Load (kg)101010
Moving Speed (mm/s)0.1~5000.1~5000.1~500
Repeat Accuracy (mm)±0.02±0.02±0.02
Overall Dimension(W×D×H)500×600×500mm700×800×500mm1300×1100×1600mm

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

Adhesives.jpg

Adhesive R&D

Epoxy structural adhesive, sealant, hot‑melt adhesive, pressure‑sensitive adhesive, modified adhesive

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Precision Electronic Assembly

Underfill adhesive, conductive adhesive, SMT adhesive, dispensing adhesive, chip bonding adhesive

Electronic Materials.jpg

Biosensors

Encapsulation adhesive, reagent immobilization material, microfluidic bonding adhesive, biocompatible adhesive, sensor sealant

Thermal Conductive Silicone.jpg

Microelectronic Packaging

Packaging epoxy adhesive, molding compound, lead bonding adhesive, substrate bonding adhesive, passivation layer material

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Functional Coatings

Hydrophobic coating, conductive coating, insulating coating, anti‑corrosion coating, wear‑resistant coating

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Electronic Pastes

Silver paste, copper paste, carbon paste, resistance paste, dielectric paste

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Measured Defoaming‑Process Performance

Measured Processing Results for Six Typical Materials

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Paste‑like Materials

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Glue with Powder

Polymer Materials.jpg

Polymer Materials

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Pharmaceutical Gel

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Silver Paste Materials

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Battery Slurry

Precautions for Use

Comparison of Material State Before and After Three-Roll Milling

PrecautionsDescription
Liquid Viscosity MatchingAdjust dispensing parameters (speed / delay / glue‑off time) for liquids of different viscosities. Trial adjustment is recommended for first‑time use.
Needle SelectionSelect proper needle specifications according to glue volume and liquid viscosity. Needle inner diameter affects dispensing performance.
Cleaning & MaintenanceClean dispensing valve and needle regularly to prevent clogging by cured glue. Flush pipelines when changing liquids.
Program ManagementBuild product program library with marked product names and parameters for quick recall.
Environmental RequirementsKeep working environment clean to avoid dust affecting dispensing quality. UV glue shall be stored away from light.
Safe OperationDo not put hands into working area while equipment is running. Press stop button in case of emergency.

* Internal laboratory test data. Actual improvement varies with material formulas. Contact sales for real‑world customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


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