Solder Paste
Solder paste bubbles solved in one go! Measured degassing solution for SMT soldering.
SIENOX provides practical test cases of vacuum degassing for solder paste, covering three typical working conditions: standard SMT printing solder paste (Type 4), fine-pitch high-density solder paste (Type 5), and semiconductor packaging grade solder paste (Type 6). Bubble removal rate＞98%, free material testing available.
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