Temperature-Controlled Vacuum Mixer
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Temperature‑Controlled Vacuum Mixing‑Defoamer SIE‑MIX5000WK
5L Large‑Capacity Temperature‑Controlled Production Platform · Nano‑Level Deep Defoaming with Vacuum & Temperature Control
5000mL Large‑Capacity Dual‑Cup + Ambient Heating/Cooling Control + -98kPa Deep Vacuum Defoaming
SIENOX SIE‑MIX5000WK is a temperature‑controlled vacuum mixing‑defoamer built for large‑volume mass production of temperature‑sensitive materials. 5000mL dual‑cup meets continuous production‑line processing requirements. Dual‑mode temperature control precisely regulates material temperature. -98kPa vacuum defoaming combined with dual‑power planetary revolution‑rotation completes mixing and defoaming in one step.
✓ CE Certification ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Customizable voltage (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles in materials directly affect finished‑product yield and performance
New Energy IndustryBubbles in lithium battery slurry affect coating uniformity and reduce consistency of battery capacity and cycle life; bubbles in photovoltaic EVA film cause lamination defects and delamination risks. Heat generated during mixing of new energy slurries alters rheological properties. Temperature-controlled defoaming stabilizes the temperature window to guarantee coating quality. | Semiconductor IndustryBubbles in semiconductor encapsulation materials lead to packaging voids and poor heat dissipation; bubbles in conductive silver adhesive cause circuit breakpoints and resistance fluctuation. Semiconductor materials are temperature-sensitive. Excessive temperature changes curing properties. Temperature-controlled defoaming is critical to balance defoaming efficiency and material safety. | Adhesive IndustryBubbles in structural adhesives result in fluctuating bonding strength and discontinuous bearing surfaces; bubbles in sealants cause leakage on sealing surfaces. Curing of most adhesives is exothermic. Temperature rise accelerates reactions and aggravates bubble generation. Temperature-controlled mixing and defoaming removes bubbles while maintaining temperature. |
✨ Traditional defoaming bottlenecks: Manual mixing produces uneven blending and entraps air. Conventional devices deliver limited centrifugal force and struggle to eliminate micro‑bubbles. Standard equipment lacks temperature control, and direct heating easily triggers thermal degradation of temperature‑sensitive materials. This solution combines centrifugal mixing, vacuum negative pressure and precise temperature control to complete mixing, temperature regulation and defoaming in one single step.
Why Choose MIX5000
Three Core Features Cover Full Workflow of Temperature‑Controlled Vacuum Mixing‑Defoaming
5L Large‑Capacity Temperature‑Controlled Production Platform5000mL dual‑cup configuration, 0‑1200rpm wide‑range speed covers medium‑high to low‑viscosity materials. 100‑set recipe storage supports frequent product switching. 550kg stable frame with 304 stainless‑steel structure ensures reliable long‑term temperature‑controlled operation. | Nano‑Level Deep Defoaming with Vacuum & Temperature ControlStandard ‑98 kPa vacuum system. Centrifugal force removes large bubbles while vacuum negative pressure eliminates nano‑scale micro‑bubbles. Vacuum runs synchronously with temperature control: heating reduces viscosity to speed up bubble release; vacuum compensates defoaming efficiency drop at low temperature for consistent defoaming performance throughout process. | Precise Temperature Regulation with Multi‑Segment SpeedPlanetary‑to‑container speed ratio optional (fixed / adjustable). Fixed mode guarantees mass‑production consistency; adjustable mode fits R&D trial runs. Dual‑mode temperature control reduces viscosity under heating and suppresses thermal degradation under cooling. One unit covers both heated mixing and low‑temperature defoaming workflows. |
✨ MIX5000WK suits large-capacity temperature-controlled production and vacuum defoaming of temperature-sensitive materials in new energy, semiconductor, adhesive and advanced material industries.
Working Principle
Adopting a synergistic process of planetary revolution, container rotation, sealed vacuum defoaming and temperature control to achieve one-step mixing, temperature regulation and defoaming.
Step 1: Centrifugal Force from Revolution High-speed rotation of the rotary plate generates centrifugal force to drive full convection of materials for macro mixing, and pushes bubbles toward the axis for escape. The temperature control system runs simultaneously to keep materials within target temperature range. Step 2: Shear Force from Rotation Container rotation produces shear force to break agglomerated particles for micro dispersion. Fixed speed ratio ensures efficient mixing across the whole chamber. Shear force thins bubble membranes to accelerate rupture. No stirring paddle contacts materials to reduce contamination risk. Step 3: Deep Defoaming under Vacuum Negative Pressure The vacuum system activates to form negative pressure, lowering pressure difference inside and outside bubbles so deep microbubbles expand and escape. -98kPa vacuum level adapts to materials of various viscosities; continuous gas extraction improves material density. Step 4: Precise Temperature Control for Material State The temperature control system works throughout the whole process, with normal-to-heating or normal-to-cooling modes available. Heating reduces viscosity to improve fluidity and speed up bubble removal; cooling suppresses thermal degradation and controls exothermic reactions. Temperature control runs synchronously with stirring and defoaming, no separate temperature adjustment procedure required. Inside the sealed container, materials go through the full workflow of "Mixing → Dispersion → Vacuum Defoaming → Temperature Adjustment", completing temperature-controlled vacuum stirring and defoaming in one step. | ![]() |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Equipment Model | SIE‑MIX5000WK |
| Mixing Capacity | 0‑5000 mL (standard container) * Customizable |
| Container Type | Test tube / Can / Cup; supports syringe & cartridge adapter |
| Container Quantity | 1 or 2 cans (user‑selectable) |
| Max Speed | 0‑1200 RPM (stepless adjustable) |
| Temperature Control Mode | Cooling / Heating |
| Vacuum Degree | Standard: –98 kPa / Optional: –100 kPa |
| Control System | Touch screen, stores up to 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) |
| Overall Dimension(W×D×H) | 1370 × 1130 × 965 mm |
| Net Weight | 550kg |
| Certifications | CE, ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
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搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
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为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Technical Specification List
Full‑line parameter specifications to assist your accurate process‑model selection
| Equipment Model | SIE‑MIX2000WK | SIE‑MIX5000WK | SIE‑MIX15LWK |
| Mixing Capacity | 0‑2000 mL (standard container) * Customizable | 0‑5000 mL (standard container) * Customizable | 0‑15L (standard container) * Customizable |
| Container Type | Test tube / Can / Cup; supports syringe & cartridge adapter | Test tube / Can / Cup; supports syringe & cartridge adapter | Test tube / Can / Cup; supports syringe & cartridge adapter |
| Container Quantity | 1 or 2 cans (user‑selectable) | 1 or 2 cans (user‑selectable) | 1 or 2 cans (user‑selectable) |
| Max Speed | 0‑2000 RPM (stepless adjustable) | 0‑1200 RPM (stepless adjustable) | 100‑600 RPM (stepless adjustable) |
| Temperature Control Mode | Cooling / Heating | Cooling / Heating | Cooling / Heating |
| Vacuum Degree | Standard: –98 kPa / Optional: –100 kPa | Standard: –98 kPa / Optional: –100 kPa | Standard: –98 kPa / Optional: –100 kPa |
| Control System | Touch screen, stores up to 100 recipe sets | Touch screen, stores up to 100 recipe sets | Touch screen, stores up to 100 recipe sets |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) |
| Overall Dimension(W×D×H) | 1100 × 780 × 880 mm | 1370 ×1130 × 965mm | 1735 × 1560 × 965 mm |
| Net Weight | 225kg | 550kg | 830 kg |
*** Above are typical models only. Customized solutions available upon customer requirements.
Multi‑Industry Solutions
Provide customized solutions to meet comprehensive demands from cutting‑edge R&D to large‑scale mass production
Lithium‑battery IndustryLithium‑ion cathode slurry, anode slurry, electrolyte, diaphragm coating liquid, conductive slurry |
Photovoltaic & Energy Storage IndustryPV EVA film, energy‑storage electrode slurry, fuel‑cell catalyst layer slurry, proton‑exchange membrane slurry |
Encapsulation Material IndustrySemiconductor encapsulant, LED phosphor powder, insulating black adhesive, molding compound, underfill adhesive |
Conductive Material IndustryConductive silver adhesive, silver paste, gold paste, electronic solder paste, conductive ceramic slurry |
Adhesive IndustryStructural adhesive, epoxy sealant, silicone sealant, hot‑melt adhesive, polyurethane adhesive |
Advanced‑material IndustryResin intermediate, catalyst slurry, functional coating liquid, ceramic slurry, nanocomposite material |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Measured Defoaming‑Process Performance
Thoroughly eliminate material bubbles, voids and stratification
High‑Viscosity Resin |
Optoelectronic Epoxy Resin |
Biological Gel |
High‑Viscosity Adhesive |
Silver Paste |
Structural Adhesive |
Measured Data Comparison
Quantifiable Effects Validated by Test Data
| Material Type | Condition Before Treatment | After MIX5000WK Treatment |
| Lithium‑ion Battery Cathode Slurry | Abundant internal bubbles, ~6% coating pin‑hole rate and large thickness deviation | Bubbles eliminated, low pin‑hole rate and uniform coating thickness |
| Semiconductor Encapsulation Adhesive | Dense internal bubbles, ~5% encapsulation void rate and heat dissipation fluctuation | Bubbles eliminated, low void rate and stable heat dissipation |
| Epoxy Structural Adhesive | Dense internal bubbles, ±25% bonding strength deviation and voids on bearing surface | Bubbles eliminated, ±5% bonding strength deviation and continuous bearing surface |
* Internal laboratory test data. Actual improvement varies with material formula. Contact sales for real‑world customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.
Stirring & Defoaming Solution for Powders and Fluids | AB Structural Adhesive Mixing & Defoaming Solution | Mixing and Defoaming Solution for High‑Viscosity Colloid and Phosphor Powder Materials |















