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Pressurized Defoaming Machine SIE-RX3-300
Small Chamber Rapid Pressurization · 3 Flexible Modes for R&D Samples
φ300 Small Chamber with 5-min Fast Pressurization + Switchable 3 Pressure & Heating Modes + Precision Filter to Prevent Secondary Sample Contamination
SIENOX SIE-RX3-300 Pressurized Defoaming Machine features a φ300×300mm cylindrical chamber of approx.75L, reaching 0.6MPa within 5 minutes. Three working modes are optional. SMC digital pressure gauge offers ±0.01MPa accuracy, and OMRON PID temperature control achieves ±1.0℃ precision. Pressure and heat eliminate bubbles generated during lamination and improve adhesion between materials.
✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage (110V/220V)
Why Remove Bubbles From Materials
Microbubbles remaining during material lamination directly impair product quality.
LCD Polarizer Lamination IndustryResidual bubbles in OCA optical adhesive cause uneven light transmission and mottled display when laminating LCD polarizers and glass substrates, degrading screen quality. Pressurized defoaming shrinks and dissolves bubbles under pressure; heat reduces OCA viscosity to discharge bubbles. The φ300 small chamber fits small polarizer samples for fast R&D parameter verification. | Electronic Component Packaging IndustryBubbles inside encapsulation glue create voids. Moisture intrusion leads to component failure, requiring repeated R&D parameter debugging. Three selectable working modes match adhesive properties: pressurize-first or heat-pressurize sync. Fast small-chamber cycling shortens trials to find optimal encapsulation processes. | Medical Device IndustryBubbles in medical bonding lamination hurt biocompatibility and structural strength; small batches are used for trial validation. The precision filter prevents secondary contamination. The φ300 chamber suits small medical sample lamination, with audible & visual alarms for safe operation. |
✨ Dilemmas of conventional defoaming: R&D trials lack dedicated pressurized defoamers. Natural bubble escape by standing takes long with low efficiency; ordinary ovens heat without pressure and cannot remove interfacial bubbles. Poor temperature accuracy causes unstable OCA flow and unrepeatable parameters.
Why Choose SIE-RX3-300
Solves R&D efficiency & quality pain points via fast pressurization, flexible modes and clean trials.
Small Chamber Rapid Pressurizationφ300×300mm cylindrical chamber of approx.75L, pressurizes to 0.6MPa in 5 mins and depressurizes within 2-3 mins. Single cycle takes 35-40 mins for fast turnaround. Fast pressure rise/drop enables quick iteration of process parameters, multiple test runs per day to shorten R&D cycles. | 3 Switchable Working ModesThree working modes available: A.Pressurize first then heat; B.Heat and pressurize simultaneously; C.Heat first then pressurize. Materials respond differently to pressure & temperature. Select modes by material features, microcomputer saves repeatable parameters to identify optimal processes. | Precision Filter for Contamination PreventionInlet air passes through precision filter before entering chamber to protect samples from dust impurities. R&D samples are costly and limited; single contamination may ruin the whole batch. Precision filtration maintains clean environment and improves test success rate. |
✨ If your work involves R&D trials, sample lamination & parameter tuning, RX3-300 enables fast iteration with rapid pressurization and 3 switchable modes.
Working Principle
Pressure and heat remove lamination bubbles and boost adhesion between diverse materials.
Step 1: Pressurization & Heating (3 optional modes): Choose pressurize-first, heat-pressurize sync or heat-first according to material properties. Resistive heating plus pressure builds defoaming environment. Step 2: Pressure Holding for Defoaming: Maintain constant pressure & temperature. Pressure shrinks and dissolves interfacial bubbles; heat reduces material viscosity to release bubbles. Step 3: Pressure Relief & Stabilization: Slowly release pressure to atmospheric level. Material adhesion improves and lamination bubbles are eliminated. Simple 3 steps: Pressurize & Heat → Hold Pressure for Defoaming → Depressurize & Stabilize, remove lamination bubbles and strengthen adhesion. |  |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE-RX3-300 |
| Chamber Size | φ300×300mm (Cylindrical) |
| Effective Volume | Approx. 75L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Working Modes | A. Pressurize then heat B. Heat & pressurize simultaneously C. Heat then pressurize |
| Control System | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx.700×900×1300mm (Subject to actual product) |
| Net Weight | 200 kg |
| Certifications | ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么？用于哪些行业？
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备，脱泡同时混料，避免二次气泡混入，常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理，广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备？
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势？
源头厂家直供可省去中间环节，价格更透明，同时能提供参数定制、来料试机、工艺验证等服务，售后响应更直接。
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搅拌脱泡机的工作原理？
施诺斯设备采用行星式混合原理：料罐在自转的同时绕公转轴公转，物料在罐内随之翻动混合，同时抽真空脱泡。整个过程设备不设搅拌桨，搅拌部件不接触物料，不会引入金属异物，混合均匀不分层。
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为什么选择施诺斯？
施诺斯（SIENOX）是广州施诺斯科技股份有限公司旗下品牌，2014 年成立，专注脱泡机与搅拌机的研发与制造，团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计，不设搅拌桨，行星式公转加自转运动辅以真空系统，高效除泡，混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材，广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证，拥有 30 余项专利，服务富士康、比亚迪、清华大学等企业与科研院所。
Multi‑Model Specification Comparison Table
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Model | SIE-RX3-300 | SIE-RX6-900 | SIE-RX8-1200 |
| Chamber Size | φ300×300mm | φ600×900mm | φ800×1200mm |
| Effective Volume | 75L | 255L | 600L |
| Pressure Range | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) |
| Temperature Range | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 220V, 50/60Hz (Custom 110V for US & Japan available) | 220V, 50/60Hz (Custom 110V for US & Japan available) | 220V, 50/60Hz (Custom 110V for US & Japan available) |
| Overall Dimension(W×D×H) | 510 × 430 × 500 mm | 610 × 560 × 780 mm | 610 × 560 × 780 mm |
| Net Weight | 95 kg | 153 kg | 163 kg |
***The above are typical models only. Customized solutions are available upon customer requirements.
Multi‑Industry Solutions
Covers mixing & defoaming for typical materials across six major industries
LCD Polarizer LaminationSmall-size polarizer OCA optical adhesive, LCD glass substrate lamination adhesive |
Electronic Component PackagingComponent encapsulation adhesive, chip encapsulation compound |
Medical DevicesMedical bonding adhesive, medical device lamination adhesive |
LED PackagingLED encapsulation adhesive, phosphor paste |
Fine ChemicalsFine chemical materials, nano powders |
New Energy MaterialsR&D samples of new energy materials, battery slurry test samples |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry & Powder |
Adhesive |
Hydrogen Energy Materials |
Adhesive |
Substrate & Filler |
Adhesive & Ceramic Powder |
Measured Data Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Pre-Treatment Status | After RX3-300 Treatment |
| Polarizer OCA Optical Adhesive | Heavy bubbles, uneven light transmission & mottled display after lamination | Bubble-free transparent adhesive with uniform light transmission |
| Electronic Component Encapsulation Adhesive | Dense bubbles causing voids after curing | Void-free solid adhesive for reliable encapsulation |
| Medical Bonding Adhesive | Bubbles harm bonding interface & biocompatibility | Compact adhesive, intact interface and qualified biocompatibility |
* Internal lab test data. Actual improvement varies by formulation. Contact sales for real customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.
