Pressure Degassing Autoclave

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Pressure Defoaming Machine SIE-RX4-600


Fast Pressure Rise in Small Chamber · Three Modes for Flexible R&D Sample Switching

φ400 Small Chamber 5-Minute Fast Pressure Rise + Three Pressure & Heating Modes Flexible Switching + Precision Filter Prevents Sample Secondary Contamination

Schnos SIE-RX4-600 Pressure Defoaming Machine, φ400×600mm cylindrical chamber with approximately 75L capacity, pressure rises to 0.6MPa in 5 minutes. Three working modes available, SMC digital pressure gauge accuracy ±0.01MPa, Omron PID temperature control accuracy ±1.0°C. Utilizes pressure and temperature to remove bubbles generated during the lamination process and enhance adhesion between materials.

✓ ISO9001 Quality System ✓ RoHS Compliant ✓ Custom Voltage Supported (110V/220V)

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Why Must Microbubbles in Materials Be Eliminated?

Residual micro‑bubbles degrade end‑product quality directly

LCD Polarizer Lamination Industry

During the lamination of LCD polarizers with glass substrates, residual bubbles in OCA optical adhesive cause uneven light transmission and display haze, affecting screen display quality. Pressure defoaming compresses and dissolves bubbles through pressure, while temperature reduces OCA adhesive viscosity to assist bubble expulsion. The φ400 small chamber is suitable for sample lamination defoaming of small-size polarizers during the R&D stage, enabling rapid verification of process parameters.

Electronic Component Packaging Industry

Bubbles in electronic component packaging adhesive cause voids in the packaging layer, and moisture intrusion leads to device failure, requiring repeated process parameter adjustment during the R&D stage. The three working modes of pressure defoaming allow selection of pressurize-first-then-heat or simultaneous heating and pressurization based on packaging adhesive characteristics. The small chamber's rapid pressure rise shortens the prototyping cycle, helping R&D teams quickly determine the packaging defoaming process solution.

Medical Device Industry

Bubbles in medical device bonding and lamination affect biocompatibility and structural strength, requiring small-batch verification of defoaming effectiveness during the prototyping stage. The pressure defoaming precision filter prevents secondary contamination of products, the φ400 chamber is suitable for sample lamination defoaming of small-size medical devices, and the audible-visual-light alarm ensures safe and controllable prototyping processes.

✨ The dilemma of traditional defoaming: during the R&D prototyping stage, there is a lack of professional pressure defoaming equipment. Relying on standing still to wait for bubbles to escape naturally takes a long time and has low efficiency; ordinary ovens only heat without pressurizing, making it difficult to expel bubbles from the lamination surface; inaccurate temperature control causes large variations in OCA adhesive fluidity, making process parameters difficult to reproduce stably.

Why Choose SIE-RX4-600

Address the pain points of efficiency and quality in the R&D trial‑production phase from three dimensions: rapid pressure rise, flexible modes, and clean trial‑production.

Small‑chamber Rapid Pressure Rise

The φ400×600 mm cylindrical chamber has a volume of approximately 75 L. It reaches 0.6 MPa within 5 minutes, completes pressure relief in 2‑3 minutes, and enables fast cycle turnover of 35‑40 minutes per cycle. Thanks to fast pressure rise and drop in the small chamber, process parameters can be iterated rapidly during R&D trial‑production. Multiple sets of conditional tests can be finished within one day to shorten the R&D cycle.

Flexible Switching Among Three Modes

Three working modes are available: A. Pressurize first, then heat up; B. Heat up and pressurize simultaneously; C. Heat up first, then pressurize. Different materials respond differently to pressure and temperature. The three modes can be flexibly selected according to material properties. Parameters controlled by the microcomputer can be stored and reproduced to assist R&D teams in identifying feasible process solutions.

Anti‑pollution by Precision Filter

Inlet air passes through a precision filter before entering the chamber, preventing dust and impurities in the air from contaminating trial‑production samples. Samples in R&D trial‑production are high‑value and low‑volume; a single contamination incident may waste the entire batch. Precision filtration ensures a clean trial‑production environment and improves trial‑production success rates.

✨ If your scenarios include R&D trial‑production, small‑sample lamination verification and process‑parameter debugging, the rapid pressure rise of the RX4‑600 small chamber and flexible switching among three modes enable you to achieve rapid iteration.

Working Principle

Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.

Step 1: Pressurization and Heating (Three‑mode Optional)
Select pressurize‑first‑then‑heat, simultaneous heating‑pressurization or heat‑first‑then‑pressurize according to material properties. Resistive heating cooperates with pressurization to build a defoaming environment. 

Step 2: Pressure‑holding Defoaming
Maintain constant pressure and temperature. Pressure compresses and dissolves bubbles on the bonding interface, while temperature reduces material viscosity to help bubbles escape from the bonding surface. 

Step 3: Pressure Relief and Stabilization
Slowly release pressure to normal atmospheric pressure. Adhesion between materials is enhanced and bubbles on the bonding interface are eliminated. 


Three simple steps: Pressurization & Heating → Pressure‑holding Defoaming → Pressure Relief & Stabilization, to eliminate bonding bubbles and strengthen adhesive force.

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Technical Specifications

Complete Technical Specifications Overview, Customizable on Demand

Equipment ModelSIE‑RX4‑600
Working Chamber Sizeφ400×600mm (Cylindrical)
Effective VolumeApprox. 75L
Working Pressure0~0.8MPa (Standard), 0~2.5MPa (Optional)
Working TemperatureAmbient ~80℃ (Standard), Ambient ~180℃ (Optional)
Heating MethodResistive Heating
Working ModesA. Pressurize first then heat up B. Simultaneous heating and pressurization C. Heat up first then pressurize
Control ModeMicrocomputer Control
Vessel MaterialS30408 Stainless Steel or Carbon Steel
Overall Dimension(W×D×H)Approx. 700×900×1300mm (Subject to actual product)
Net Weight200 kg
CertificationsISO9001, RoHS Compliance


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FAQ 您关心的问题

为您解答关于产品性能及日常工艺选型中的常见疑问

  • 真空脱泡搅拌机是什么?用于哪些行业?

    真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。

  • 广州施诺斯主要生产哪些设备?

    主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。

  • 源头厂家采购脱泡设备有什么优势?

    源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。

  • 搅拌脱泡机的工作原理?

    施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。

  • 为什么选择施诺斯?

    施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。

Multi‑Model Specification Comparison Table

Compare Models in the Same Series for Accurate Selection

Equipment ModelSIE‑RX4‑600SIE‑RX6‑900SIE‑RX8‑1200
Working Chamber Sizeφ400×600mmφ600×900mmφ800×1200mm
Effective Volume75L255L600L
Pressure Range0~2.5MPa(Optional)0~2.5MPa(Optional)0~2.5MPa(Optional)
Temperature RangeAmbient ~180℃(Optional)Ambient ~180℃(Optional)Ambient ~180℃(Optional)
Pressure Accuracy±0.01MPa±0.01MPa±0.01MPa
Temperature Control Accuracy±1.0℃±1.0℃±1.0℃
Power Supply220V, 50/60Hz (110V US‑JP standard customizable)220V, 50/60Hz (110V US‑JP standard customizable)220V, 50/60Hz (110V US‑JP standard customizable)
Overall Dimension(W×D×H)510 × 430 × 500 mm610 × 560 × 780 mm610 × 560 × 780 mm
Net Weight95 kg153 kg163 kg

***The above are typical models only. Customized solutions are available according to customer requirements.

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

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LCD Polarizer Lamination

Small‑size polarizer OCA optical adhesive, lamination adhesive for LCD glass substrate

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Electronic Component Encapsulation

Component encapsulant, chip potting adhesive

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Medical Devices

Medical bonding adhesive, medical device lamination adhesive

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LED Encapsulation

LED encapsulant, phosphor paste

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Fine Chemicals

Fine chemical materials, nano‑powders

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New Energy Materials

R&D samples of new energy materials, small‑lot battery slurry

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Actual‑test Performance Demonstration

Measured Processing Results for Six Typical Materials

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Slurry + Powder

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Adhesive

氢能材料.jpg

Hydrogen‑energy Materials

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Adhesive

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Substrate + Filler

胶+陶瓷粉搅拌脱泡.jpg

Adhesive + Ceramic Powder

Actual‑test Effect Comparison

Comparison of Material Status Before and After Pressurized Debubbling

Material TypePre‑treatment StatusAfter RX4‑600 Treatment
Polarizer OCA Optical AdhesiveNumerous bubbles inside adhesive, uneven light transmission and mottling after laminationTransparent bubble‑free adhesive with uniform light transmission after lamination
Component EncapsulantDense bubbles inside adhesive, voids formed in encapsulation layer after curingDense void‑free adhesive for complete and reliable encapsulation layer
Medical Bonding AdhesiveInternal bubbles, bonding‑surface defects impairing biocompatibilityDense adhesive with intact bonding surface and qualified biocompatibility

* Internal laboratory test data. Actual improvement varies with material formulation. Contact sales for real‑world customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


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