Pressure Degassing Autoclave

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Pressurized Defoaming Machine SIE-RX4-400


Small Chamber Rapid Pressurization · 3 Flexible Modes for R&D Samples

φ400 small chamber achieves pressurization in 5 mins + three selectable heat-pressure modes + precision filter to avoid sample secondary contamination

SIENOX SIE-RX4-400 Pressurized Defoaming Machine adopts φ400×400mm cylindrical chamber with approx.75L volume, pressurizes to 0.6MPa within 5 mins. Three optional working modes. SMC digital pressure gauge with ±0.01MPa accuracy and Omron PID temperature control of ±1.0℃. Pressure and heat eliminate lamination bubbles and strengthen adhesion between diverse materials.

✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage (110V/220V) Available

在线留言 免费寄样测试 工程师热线:189-2512-9293

Why Eliminate Bubbles in Materials

Residual microbubbles during material lamination directly impair product quality.

LCD Polarizer Lamination Industry

Residual bubbles in OCA optical adhesive during lamination of LCD polarizer and glass substrate cause uneven light transmission and mottled display, deteriorating screen quality. Pressurized defoaming shrinks and dissolves bubbles via pressure; heat reduces OCA viscosity to release bubbles. The φ400 small chamber suits small polarizer sample debubbling for quick process parameter verification in R&D.

Electronic Component Packaging Industry

Bubbles in encapsulation adhesive create voids, allowing moisture ingress and device failure. Repeated parameter tuning is required in R&D. Three working modes support pressurize-first or heat-pressure sync per adhesive properties. Fast pressurization of small chamber shortens trial cycles for fast process confirmation.

Medical Device Industry

Bubbles in medical bonding impair biocompatibility and structural strength; small-batch tests are needed for trial production. The precision filter avoids secondary contamination. The φ400 chamber fits lamination debubbling of small medical samples, with audible & visual alarms for safe operation.

✨ Dilemmas of Traditional Defoaming Methods: In the R&D and trial production stage, professional pressurized defoaming equipment is usually unavailable. Natural bubble removal by long-time static waiting results in low efficiency. Ordinary ovens only provide heating without pressurization, making interfacial bubbles hard to eliminate. Inaccurate temperature control causes unstable fluidity of OCA adhesive, leading to poor repeatability of process parameters.

Why Choose SIE-RX4-400

Solve R&D efficiency and quality pain points via rapid pressurization, flexible modes and clean trial production.

Small Chamber & Rapid Pressurization

φ400×400mm cylindrical chamber with approx.75L volume. Pressurize to 0.6MPa in 5 mins and release pressure within 2-3 mins, single cycle takes 35-40 mins for fast turnaround. Fast pressure rise & drop enables rapid iteration of process parameters in R&D trials. Multiple test groups can be finished per day to shorten R&D cycles.

3 Flexible Switchable Modes

Three working modes available: A. Pressurize first then heat; B. Heat and pressurize simultaneously; C. Heat first then pressurize. Materials respond differently to pressure and temperature. Select proper mode according to material properties. Microcomputer control supports parameter storage & reproduction to help confirm optimal process recipes.

Precision Filter for Contamination Prevention

Incoming air passes through precision filter before entering chamber to avoid dust impurity contamination of test samples. R&D samples are high-value and limited in quantity; contamination may ruin the whole batch. The precision filter maintains clean trial environment and improves test success rate.

✨ If your application involves R&D trials, small sample lamination verification and process parameter tuning, RX4-400’s small chamber rapid pressurization and three flexible modes enable fast iteration.

Working Principle

Pressure and heat eliminate bubbles generated during lamination and boost adhesion between different materials.

Step 1: Pressurization & Heating (3 modes optional): Choose pressurize first then heat, heat and pressurize simultaneously, or heat first then pressurize according to material properties. Resistive heating combines with pressure to build debubbling conditions.

Step 2: Pressure Holding for Debubbling: Maintain constant pressure and temperature. Pressure compresses and dissolves bubbles at lamination interface, while heat reduces material viscosity to help bubbles escape.

Step 3: Pressure Relief & Stabilization: Slowly release pressure to atmospheric level. Adhesion between materials is strengthened and interfacial bubbles are removed.


Simple 3 steps: Pressurization & Heating → Pressure Holding Debubbling → Pressure Relief & Stabilization, remove lamination bubbles and improve adhesion.

Pressurized Defoaming Machine Working Principle.png

Technical Specifications

Complete Technical Specifications Overview, Customizable on Demand

ModelSIE-RX4-400
Chamber Sizeφ400×400mm (Cylindrical)
Effective VolumeApprox. 75L
Working Pressure0~0.8MPa (Standard), 0~2.5MPa (Optional)
Working TemperatureAmbient ~80℃ (Standard), Ambient ~180℃ (Optional)
Heating MethodResistive Heating
Working ModesA. Pressurize first then heat B. Heat and pressurize simultaneously C. Heat first then pressurize
Control SystemMicrocomputer Control
Vessel MaterialS30408 Stainless Steel or Carbon Steel
Overall Dimension(W×D×H)Approx.700×900×1300mm (Subject to actual product)
Net Weight200 kg
CertificationsISO9001, RoHS Compliance


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FAQ 您关心的问题

为您解答关于产品性能及日常工艺选型中的常见疑问

  • 真空脱泡搅拌机是什么?用于哪些行业?

    真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。

  • 广州施诺斯主要生产哪些设备?

    主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。

  • 源头厂家采购脱泡设备有什么优势?

    源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。

  • 搅拌脱泡机的工作原理?

    施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。

  • 为什么选择施诺斯?

    施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。

Multi‑Model Specification Comparison Table

Full‑line standardized specifications for accurate process evaluation and equipment selection

ModelSIE-RX4-400SIE-RX6-900SIE-RX8-1200
Chamber Sizeφ400×400mmφ600×900mmφ800×1200mm
Effective Volume75L255L600L
Pressure Range0~2.5MPa (Optional)0~2.5MPa (Optional)0~2.5MPa (Optional)
Temperature RangeAmbient ~180℃ (Optional)Ambient ~180℃ (Optional)Ambient ~180℃ (Optional)
Pressure Accuracy±0.01MPa±0.01MPa±0.01MPa
Temperature Control Accuracy±1.0℃±1.0℃±1.0℃
Power Supply220V, 50/60Hz (Custom 110V for US & Japan standards available)220V, 50/60Hz (Custom 110V for US & Japan standards available)220V, 50/60Hz (Custom 110V for US & Japan standards available)
Overall Dimension(W×D×H)510 × 430 × 500 mm610 × 560 × 780 mm610 × 560 × 780 mm
Net Weight95 kg153 kg163 kg

***Above are typical models. Customized solutions can be provided according to customer requirements.

Multi‑Industry Solutions

Covers typical stirring and defoaming applications across six major industries.

Electronic Materials.jpg

LCD Polarizer Lamination

OCA optical adhesive for small polarizers, lamination adhesive for LCD glass substrates

New Energy.jpg

Electronic Component Packaging

Component encapsulation adhesive, chip potting compound

Medical Device 02.jpg

Medical Devices

Medical bonding adhesive, medical device lamination glue

Printing & Packaging.jpg

LED Packaging

LED encapsulation glue, phosphor paste

Metal Powder Metallurgy.jpg

Fine Chemicals

Fine chemical materials, nano powders

Ceramics.jpg

New Energy Materials

R&D samples of new energy materials, small battery slurry specimens

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Actual‑test Performance Demonstration

Measured Processing Results for Six Typical Materials

Red Slurry Mixing & Defoaming.jpg

Slurry & Powder

Adhesive Before & After Defoaming 02.jpg

Adhesive

Hydrogen Energy Materials.jpg

Hydrogen Energy Materials

Adhesive Before & After Defoaming 01.jpg

Adhesive

Substrate & Filler Mixing Defoaming.jpg

Substrate & Filler

Glue & Ceramic Powder Mixing Defoaming.jpg

Glue & Ceramic Powder

Actual‑test Effect Comparison

Comparison of Material Status Before and After Pressurized Debubbling

Material TypeCondition Before TreatmentResult After RX4-400 Treatment
Polarizer OCA Optical AdhesiveNumerous bubbles in adhesive, uneven light transmission and mottling after laminationTransparent bubble-free adhesive with uniform light transmission after lamination
Electronic Component Encapsulation AdhesiveDense bubbles in adhesive, voids formed in encapsulation layer after curingDense void-free adhesive for complete and reliable encapsulation layer
Medical Bonding AdhesiveBubbles inside adhesive, bonding defects impair biocompatibilityDense adhesive with intact bonding surface and qualified biocompatibility

* Internal lab test data. Actual improvement varies with material formula. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


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