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Pressurized Defoaming Machine SIE-RX4-400
Small Chamber Rapid Pressurization · 3 Flexible Modes for R&D Samples
φ400 small chamber achieves pressurization in 5 mins + three selectable heat-pressure modes + precision filter to avoid sample secondary contamination
SIENOX SIE-RX4-400 Pressurized Defoaming Machine adopts φ400×400mm cylindrical chamber with approx.75L volume, pressurizes to 0.6MPa within 5 mins. Three optional working modes. SMC digital pressure gauge with ±0.01MPa accuracy and Omron PID temperature control of ±1.0℃. Pressure and heat eliminate lamination bubbles and strengthen adhesion between diverse materials.
✓ CE Certificate ✓ FC Certificate ✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage (110V/220V) Available
Why Eliminate Bubbles in Materials
Residual microbubbles during material lamination directly impair product quality.
LCD Polarizer Lamination IndustryResidual bubbles in OCA optical adhesive during lamination of LCD polarizer and glass substrate cause uneven light transmission and mottled display, deteriorating screen quality. Pressurized defoaming shrinks and dissolves bubbles via pressure; heat reduces OCA viscosity to release bubbles. The φ400 small chamber suits small polarizer sample debubbling for quick process parameter verification in R&D. | Electronic Component Packaging IndustryBubbles in encapsulation adhesive create voids, allowing moisture ingress and device failure. Repeated parameter tuning is required in R&D. Three working modes support pressurize-first or heat-pressure sync per adhesive properties. Fast pressurization of small chamber shortens trial cycles for fast process confirmation. | Medical Device IndustryBubbles in medical bonding impair biocompatibility and structural strength; small-batch tests are needed for trial production. The precision filter avoids secondary contamination. The φ400 chamber fits lamination debubbling of small medical samples, with audible & visual alarms for safe operation. |
✨ Dilemmas of Traditional Defoaming Methods: In the R&D and trial production stage, professional pressurized defoaming equipment is usually unavailable. Natural bubble removal by long-time static waiting results in low efficiency. Ordinary ovens only provide heating without pressurization, making interfacial bubbles hard to eliminate. Inaccurate temperature control causes unstable fluidity of OCA adhesive, leading to poor repeatability of process parameters.
Why Choose SIE-RX4-400
Solve R&D efficiency and quality pain points via rapid pressurization, flexible modes and clean trial production.
Small Chamber & Rapid Pressurizationφ400×400mm cylindrical chamber with approx.75L volume. Pressurize to 0.6MPa in 5 mins and release pressure within 2-3 mins, single cycle takes 35-40 mins for fast turnaround. Fast pressure rise & drop enables rapid iteration of process parameters in R&D trials. Multiple test groups can be finished per day to shorten R&D cycles. | 3 Flexible Switchable ModesThree working modes available: A. Pressurize first then heat; B. Heat and pressurize simultaneously; C. Heat first then pressurize. Materials respond differently to pressure and temperature. Select proper mode according to material properties. Microcomputer control supports parameter storage & reproduction to help confirm optimal process recipes. | Precision Filter for Contamination PreventionIncoming air passes through precision filter before entering chamber to avoid dust impurity contamination of test samples. R&D samples are high-value and limited in quantity; contamination may ruin the whole batch. The precision filter maintains clean trial environment and improves test success rate. |
✨ If your application involves R&D trials, small sample lamination verification and process parameter tuning, RX4-400’s small chamber rapid pressurization and three flexible modes enable fast iteration.
Working Principle
Pressure and heat eliminate bubbles generated during lamination and boost adhesion between different materials.
Step 1: Pressurization & Heating (3 modes optional): Choose pressurize first then heat, heat and pressurize simultaneously, or heat first then pressurize according to material properties. Resistive heating combines with pressure to build debubbling conditions. Step 2: Pressure Holding for Debubbling: Maintain constant pressure and temperature. Pressure compresses and dissolves bubbles at lamination interface, while heat reduces material viscosity to help bubbles escape. Step 3: Pressure Relief & Stabilization: Slowly release pressure to atmospheric level. Adhesion between materials is strengthened and interfacial bubbles are removed. Simple 3 steps: Pressurization & Heating → Pressure Holding Debubbling → Pressure Relief & Stabilization, remove lamination bubbles and improve adhesion. | ![]() |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE-RX4-400 |
| Chamber Size | φ400×400mm (Cylindrical) |
| Effective Volume | Approx. 75L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Working Modes | A. Pressurize first then heat B. Heat and pressurize simultaneously C. Heat first then pressurize |
| Control System | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx.700×900×1300mm (Subject to actual product) |
| Net Weight | 200 kg |
| Certifications | CE, FC, ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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脱泡机的作用是什么?
脱泡机是一种用于去除液体中的气泡的设备。它的作用在于帮助生产过程中的液体混合、反应、涂布、印刷、灌注等工艺环节,避免气泡的产生和对最终产品的影响。在许多工业和实验室环境中,去除气泡是非常必要的,因为气泡可能会对产品质量产生负面影响,如影响表面张力和稳定性等问题。脱泡机通常采用各种不同的技术,如振动、超声波、离心等,以实现有效的气泡去除。它的应用领域广泛,包括但不限于半导体、太阳能、光学、生物技术、材料科学等。
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售后服务怎么样?
公司拥有专业的售后服务人员,24小时专人服务,一对一提供技术支持,解决您的后顾之忧。
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为什么要选择施诺斯?
选择施诺斯的原因有很多,以下是一些主要的原因:
1. 专业性:我们的团队由一群专业的人士组成,他们在各自的领域拥有丰富的经验和知识。我们不仅了解行业趋势和最佳实践,而且还能提供切实可行的解决方案。
2. 服务质量:我们注重客户的需求和满意度,始终致力于提供高质量的服务。我们不仅快速响应客户需求,而且还能根据客户的要求进行定制化服务。
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4. 创新性:我们不断探索新的方法和工具,以提供更好的服务并满足客户的需求。我们鼓励创新和实验,并愿意接受挑战和改变。
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6. 团队合作:我们相信团队的力量和合作的价值,我们的团队成员之间互相支持、协作和尊重。我们与客户、合作伙伴和其他利益相关者建立紧密的合作关系,以实现共同的目标。
以上只是选择我们的部分原因,我们相信还有很多其他的优点和价值可以为客户提供。如果您正在寻找一家专业、可靠、高质量的服务提供商,我们非常期待与您的合作。
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搅拌脱泡机的工作原理?
施诺斯搅拌脱泡机通过公转的离心力进行脱泡,通过公转与自转形成的剪切力进行搅拌,
再辅助以真空泵抽取气体以达到真空状态,去除纳米级微小气泡。 不接触物料,无二次污染,无二次浪费。
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施诺斯能为广大客户提供全面的工程和现代化的咨询服务。施诺斯近二十年的搅拌经验,可以为你提供高效的咨询服务。
想要让搅拌机性能更上一层楼,提升系统的整体效能?我们有全面的咨询、工程以及现代化改造服务,为您量身打造解决方案。 在如今竞争激烈的全球化浪潮中,唯有不断创新、持续优化,才能始终跑在对手前面。您的生产工艺和产品日新月异,我们就为您提供最适配的混合技术。不管是新的产品参数,还是既有的工艺条件,我们都能对现有系统和搅拌设备进行全方位的检查与评估,挖掘其中潜藏的流程优化空间和机械性能提升潜力,并且帮您把这些改进切实落地。 要是您的搅拌设备已经跟不上时代步伐,能耗居高不下,或是维护成本让您头疼不已,那就别犹豫,我们的咨询、工程设计和现代化改造服务,就是为您排忧解难的良方。欢迎随时联系我们,携手开启高效生产新征程!
Multi‑Model Specification Comparison Table
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Model | SIE-RX4-400 | SIE-RX6-900 | SIE-RX8-1200 |
| Chamber Size | φ400×400mm | φ600×900mm | φ800×1200mm |
| Effective Volume | 75L | 255L | 600L |
| Pressure Range | 0~2.5MPa (Optional) | 0~2.5MPa (Optional) | 0~2.5MPa (Optional) |
| Temperature Range | Ambient ~180℃ (Optional) | Ambient ~180℃ (Optional) | Ambient ~180℃ (Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 220V, 50/60Hz (Custom 110V for US & Japan standards available) | 220V, 50/60Hz (Custom 110V for US & Japan standards available) | 220V, 50/60Hz (Custom 110V for US & Japan standards available) |
| Overall Dimension(W×D×H) | 510 × 430 × 500 mm | 610 × 560 × 780 mm | 610 × 560 × 780 mm |
| Net Weight | 95 kg | 153 kg | 163 kg |
| Certifications | CE, FC | CE, FC | CE, FC |
***Above are typical models. Customized solutions can be provided according to customer requirements.
Multi‑Industry Solutions
Covers typical stirring and defoaming applications across six major industries.
LCD Polarizer LaminationOCA optical adhesive for small polarizers, lamination adhesive for LCD glass substrates |
Electronic Component PackagingComponent encapsulation adhesive, chip potting compound |
Medical DevicesMedical bonding adhesive, medical device lamination glue |
LED PackagingLED encapsulation glue, phosphor paste |
Fine ChemicalsFine chemical materials, nano powders |
New Energy MaterialsR&D samples of new energy materials, small battery slurry specimens |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry & Powder |
Adhesive |
Hydrogen Energy Materials |
Adhesive |
Substrate & Filler |
Glue & Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Condition Before Treatment | Result After RX4-400 Treatment |
| Polarizer OCA Optical Adhesive | Numerous bubbles in adhesive, uneven light transmission and mottling after lamination | Transparent bubble-free adhesive with uniform light transmission after lamination |
| Electronic Component Encapsulation Adhesive | Dense bubbles in adhesive, voids formed in encapsulation layer after curing | Dense void-free adhesive for complete and reliable encapsulation layer |
| Medical Bonding Adhesive | Bubbles inside adhesive, bonding defects impair biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal lab test data. Actual improvement varies with material formula. Contact sales for real customer cases.












