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Pressurized Defoaming Machine SIE-RX4-400
Small Chamber Rapid Pressurization · 3 Flexible Modes for R&D Samples
φ400 small chamber achieves pressurization in 5 mins + three selectable heat-pressure modes + precision filter to avoid sample secondary contamination
SIENOX SIE-RX4-400 Pressurized Defoaming Machine adopts φ400×400mm cylindrical chamber with approx.75L volume, pressurizes to 0.6MPa within 5 mins. Three optional working modes. SMC digital pressure gauge with ±0.01MPa accuracy and Omron PID temperature control of ±1.0℃. Pressure and heat eliminate lamination bubbles and strengthen adhesion between diverse materials.
✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom Voltage (110V/220V) Available
Why Eliminate Bubbles in Materials
Residual microbubbles during material lamination directly impair product quality.
LCD Polarizer Lamination IndustryResidual bubbles in OCA optical adhesive during lamination of LCD polarizer and glass substrate cause uneven light transmission and mottled display, deteriorating screen quality. Pressurized defoaming shrinks and dissolves bubbles via pressure; heat reduces OCA viscosity to release bubbles. The φ400 small chamber suits small polarizer sample debubbling for quick process parameter verification in R&D. | Electronic Component Packaging IndustryBubbles in encapsulation adhesive create voids, allowing moisture ingress and device failure. Repeated parameter tuning is required in R&D. Three working modes support pressurize-first or heat-pressure sync per adhesive properties. Fast pressurization of small chamber shortens trial cycles for fast process confirmation. | Medical Device IndustryBubbles in medical bonding impair biocompatibility and structural strength; small-batch tests are needed for trial production. The precision filter avoids secondary contamination. The φ400 chamber fits lamination debubbling of small medical samples, with audible & visual alarms for safe operation. |
✨ Dilemmas of Traditional Defoaming Methods: In the R&D and trial production stage, professional pressurized defoaming equipment is usually unavailable. Natural bubble removal by long-time static waiting results in low efficiency. Ordinary ovens only provide heating without pressurization, making interfacial bubbles hard to eliminate. Inaccurate temperature control causes unstable fluidity of OCA adhesive, leading to poor repeatability of process parameters.
Why Choose SIE-RX4-400
Solve R&D efficiency and quality pain points via rapid pressurization, flexible modes and clean trial production.
Small Chamber & Rapid Pressurizationφ400×400mm cylindrical chamber with approx.75L volume. Pressurize to 0.6MPa in 5 mins and release pressure within 2-3 mins, single cycle takes 35-40 mins for fast turnaround. Fast pressure rise & drop enables rapid iteration of process parameters in R&D trials. Multiple test groups can be finished per day to shorten R&D cycles. | 3 Flexible Switchable ModesThree working modes available: A. Pressurize first then heat; B. Heat and pressurize simultaneously; C. Heat first then pressurize. Materials respond differently to pressure and temperature. Select proper mode according to material properties. Microcomputer control supports parameter storage & reproduction to help confirm optimal process recipes. | Precision Filter for Contamination PreventionIncoming air passes through precision filter before entering chamber to avoid dust impurity contamination of test samples. R&D samples are high-value and limited in quantity; contamination may ruin the whole batch. The precision filter maintains clean trial environment and improves test success rate. |
✨ If your application involves R&D trials, small sample lamination verification and process parameter tuning, RX4-400’s small chamber rapid pressurization and three flexible modes enable fast iteration.
Working Principle
Pressure and heat eliminate bubbles generated during lamination and boost adhesion between different materials.
Step 1: Pressurization & Heating (3 modes optional): Choose pressurize first then heat, heat and pressurize simultaneously, or heat first then pressurize according to material properties. Resistive heating combines with pressure to build debubbling conditions. Step 2: Pressure Holding for Debubbling: Maintain constant pressure and temperature. Pressure compresses and dissolves bubbles at lamination interface, while heat reduces material viscosity to help bubbles escape. Step 3: Pressure Relief & Stabilization: Slowly release pressure to atmospheric level. Adhesion between materials is strengthened and interfacial bubbles are removed. Simple 3 steps: Pressurization & Heating → Pressure Holding Debubbling → Pressure Relief & Stabilization, remove lamination bubbles and improve adhesion. | ![]() |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE-RX4-400 |
| Chamber Size | φ400×400mm (Cylindrical) |
| Effective Volume | Approx. 75L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Working Modes | A. Pressurize first then heat B. Heat and pressurize simultaneously C. Heat first then pressurize |
| Control System | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx.700×900×1300mm (Subject to actual product) |
| Net Weight | 200 kg |
| Certifications | ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
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搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
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为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Multi‑Model Specification Comparison Table
Full‑line standardized specifications for accurate process evaluation and equipment selection
| Model | SIE-RX4-400 | SIE-RX6-900 | SIE-RX8-1200 |
| Chamber Size | φ400×400mm | φ600×900mm | φ800×1200mm |
| Effective Volume | 75L | 255L | 600L |
| Pressure Range | 0~2.5MPa (Optional) | 0~2.5MPa (Optional) | 0~2.5MPa (Optional) |
| Temperature Range | Ambient ~180℃ (Optional) | Ambient ~180℃ (Optional) | Ambient ~180℃ (Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 220V, 50/60Hz (Custom 110V for US & Japan standards available) | 220V, 50/60Hz (Custom 110V for US & Japan standards available) | 220V, 50/60Hz (Custom 110V for US & Japan standards available) |
| Overall Dimension(W×D×H) | 510 × 430 × 500 mm | 610 × 560 × 780 mm | 610 × 560 × 780 mm |
| Net Weight | 95 kg | 153 kg | 163 kg |
***Above are typical models. Customized solutions can be provided according to customer requirements.
Multi‑Industry Solutions
Covers typical stirring and defoaming applications across six major industries.
LCD Polarizer LaminationOCA optical adhesive for small polarizers, lamination adhesive for LCD glass substrates |
Electronic Component PackagingComponent encapsulation adhesive, chip potting compound |
Medical DevicesMedical bonding adhesive, medical device lamination glue |
LED PackagingLED encapsulation glue, phosphor paste |
Fine ChemicalsFine chemical materials, nano powders |
New Energy MaterialsR&D samples of new energy materials, small battery slurry specimens |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry & Powder |
Adhesive |
Hydrogen Energy Materials |
Adhesive |
Substrate & Filler |
Glue & Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Condition Before Treatment | Result After RX4-400 Treatment |
| Polarizer OCA Optical Adhesive | Numerous bubbles in adhesive, uneven light transmission and mottling after lamination | Transparent bubble-free adhesive with uniform light transmission after lamination |
| Electronic Component Encapsulation Adhesive | Dense bubbles in adhesive, voids formed in encapsulation layer after curing | Dense void-free adhesive for complete and reliable encapsulation layer |
| Medical Bonding Adhesive | Bubbles inside adhesive, bonding defects impair biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal lab test data. Actual improvement varies with material formula. Contact sales for real customer cases.
Customer Delivery & Application Cases
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