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Pressurized Debubbling Machine SIE‑RX6‑900


SMC Precision Pressure Control ±0.01MPa · Stable Batch Quality for Small-Scale Lamination

SMC Digital Pressure Gauge with Precision Control ±0.01MPa + Omron PID Temperature Control ±1°C + Audible, Visual & Light Alarm Microcomputer Fault Location

Schnos SIE-RX6-900 Pressure Defoaming Machine, φ600×900mm cylindrical chamber with approximately 255L capacity, SMC digital pressure gauge accuracy ±0.01MPa, Omron PID temperature control accuracy ±1.0°C. Three working modes available, resistive heating provides fast temperature rise and good uniformity, utilizing pressure and temperature to remove bubbles generated during the lamination process and enhance adhesion between materials.

✓ ISO9001 Quality System ✓ RoHS Compliant ✓ Custom Voltage Supported (110V/220V)

在线留言 免费寄样测试 工程师热线:189-2512-9293

Why Must Microbubbles in Materials Be Eliminated?

Residual micro‑bubbles degrade end‑product quality directly

Touch‑Screen G+G Lamination Industry

During glass‑to‑glass touch‑screen lamination, residual bubbles inside OCA optical adhesive reduce touch sensitivity, cause mottled display and even delamination in severe cases. The pressurized debubbler compresses and dissolves interfacial bubbles by pressure, while temperature reduces OCA viscosity to facilitate bubble escape. The φ600 chamber fits small‑batch debubbling for medium‑small‑size touch screens. SMC precise pressure control guarantees consistent lamination quality across batches.

LED Packaging Industry

Bubbles in LED encapsulation adhesive trigger light scattering, accelerated light attenuation and premature device failure. Three selectable operation modes support simultaneous or step‑wise heating‑pressurization according to adhesive properties. Omron PID temperature control ensures proper fluidity for easy bubble removal. It suits small‑batch debubbling of LED encapsulation adhesive to secure LED luminous efficiency and service life.

Fine Chemical Material Industry

Bubbles inside fine chemicals and nano‑powder materials impair dispersion uniformity and material performance. Stable debubbling is required for quality assurance in small‑batch production. Precision filter prevents secondary material contamination. Microcomputer‑controlled storable & reproducible parameters enable pressurized debubbling for small‑batch fine chemicals and nano‑powders with stable and traceable batch quality.

✨ Traditional debubbling dilemmas: In R&D and trial production, the lack of professional pressurized debubbling equipment leads to low efficiency as bubbles can only escape naturally through long-time standing. Ordinary ovens only provide heating without pressurization, making interfacial bubbles difficult to remove. Inaccurate temperature control causes unstable fluidity of OCA adhesive, resulting in poor repeatability of process parameters.

Why Choose SIE‑RX6‑900

Solve quality consistency & safety pain points for small‑batch lamination production

Precise Pressure Control by SMC Digital Pressure Gauge

Adopted Japanese SMC digital pressure gauge with ±0.01 MPa pressure accuracy for intuitive digital readout. Precise pressure control is critical for batch consistency in small‑batch production. Featuring fast response and high stability, the SMC gauge keeps pressure deviation minimal to guarantee consistent lamination quality across batches.

Omron PID Temperature Control ±1℃

Equipped with Omron thermostat for automatic PID temperature adjustment, with temperature control accuracy of ±1.0℃ and internal temperature difference within ±3℃. Temperature directly affects fluidity of OCA adhesive and encapsulation adhesive. Accurate temperature control ensures debubbling under identical thermal conditions for each batch and prevents debubbling deviation caused by temperature fluctuation.

Audio‑Visual‑Light Alarm with Microcomputer Display

Synchronized audio‑visual‑light alarm with fault messages displayed on microcomputer for rapid fault diagnosis. Equipment failure may cause whole‑batch scrap in small‑batch production. This alarm system enables timely abnormality detection & handling to reduce losses.

✨ If your small‑batch lamination production demands consistent quality and safety, SMC precise pressure control and Omron PID temperature control of RX6‑900 ensure stable batch‑to‑batch quality.

Working Principle

Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.

Step 1: Pressurization & Heating (3 modes optional): Select heat after pressure, simultaneous heating & pressurization or pressure after heating based on material properties. Resistive heating combined with pressurization forms the defoaming environment.

Step 2: Pressure Holding & Defoaming: Maintain constant pressure and temperature. Pressure compresses and dissolves bubbles on bonding surfaces; heat reduces material viscosity to help bubbles escape.

Step 3: Pressure Relief & Stabilization: Slowly release pressure to normal atmospheric pressure. Material adhesion increases and interfacial bubbles are removed.


Three simple steps: Pressurization & Heating → Pressure Holding & Defoaming → Pressure Relief & Stabilization, eliminating bonding bubbles and improving adhesion.

Pressurization Defoamer Working Principle.png

Technical Specifications

Complete Technical Specifications Overview, Customizable on Demand

Equipment ModelSIE-RX6-900
Chamber Dimensionsφ400×600mm (Cylindrical)
Effective VolumeApprox. 255L
Working Pressure0~0.8MPa (Standard), 0~2.5MPa (Optional)
Working TemperatureRoom Temp~80°C (Standard), Room Temp~180°C (Optional)
Heating MethodResistive Heating
Working ModesA. Pressurize first then heat up B. Heat and pressurize simultaneously C. Heat up first then pressurize
Control MethodMicrocomputer Control
Tank MaterialS30408 Stainless Steel or Carbon Steel
Overall Dimensions (W×D×H)Approx. 900×1200×1500mm (Subject to actual product)
Net Weight500 kg
CertificationsISO9001, RoHS Compliant

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FAQ 您关心的问题

为您解答关于产品性能及日常工艺选型中的常见疑问

  • 真空脱泡搅拌机是什么?用于哪些行业?

    真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。

  • 广州施诺斯主要生产哪些设备?

    主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。

  • 源头厂家采购脱泡设备有什么优势?

    源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。

  • 搅拌脱泡机的工作原理?

    施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。

  • 为什么选择施诺斯?

    施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。

Multi‑Model Specification Comparison Table

Compare Models in the Same Series for Accurate Selection

Equipment ModelSIE-RX4-600SIE-RX6-900SIE-RX8-1200
Chamber Dimensionsφ400×600mmφ600×900mmφ800×1200mm
Effective Volume75L255L600L
Pressure Range0~2.5MPa (Optional)0~2.5MPa (Optional)0~2.5MPa (Optional)
Temperature RangeRoom Temp~180°C (Optional)Room Temp~180°C (Optional)Room Temp~180°C (Optional)
Pressure Accuracy±0.01MPa±0.01MPa±0.01MPa
Temperature Control Accuracy±1.0°C±1.0°C±1.0°C
Power Supply220V, 50/60Hz (110V US/Japan standard customizable)220V, 50/60Hz (110V US/Japan standard customizable)220V, 50/60Hz (110V US/Japan standard customizable)
Overall Dimensions (W×D×H)510 × 430 × 500 mm610 × 560 × 780 mm610 × 560 × 780 mm
Net Weight95 kg153 kg163 kg

***The above are only typical models. We can provide customized solutions based on customer requirements.

Multi‑Industry Solutions

Covering stirring and debubbling applications of typical materials across six major industries

智能穿戴.jpg

LCD Polarizer Lamination

Small‑size polarizer OCA optical adhesive, LCD glass substrate lamination adhesive

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Electronic Component Encapsulation

Component encapsulation adhesive, chip potting adhesive

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Medical Devices

Medical bonding adhesive, medical‑device lamination adhesive

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LED Packaging

LED encapsulation adhesive, phosphor adhesive

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Fine Chemicals

Fine chemical materials, nano‑powders

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New Energy Materials

R&D samples of new‑energy materials, small‑batch battery slurries

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Actual‑test Performance Demonstration

Measured Processing Results for Six Typical Materials

Red Slurry Mixing & Debubbling.jpg

Slurries & Powders

Adhesive Before‑after Debubbling 02.jpg

Adhesives

Hydrogen‑Energy Materials.jpg

Hydrogen‑Energy Materials

Adhesive Before‑after Debubbling 01.jpg

Adhesives

Substrate & Filler Mixing‑Debubbling.jpg

Substrates & Fillers

Adhesive & Ceramic Powder Mixing‑Debubbling.jpg

Adhesive & Ceramic Powder

Actual‑test Effect Comparison

Comparison of Material Status Before and After Pressurized Debubbling

Material TypeState Before TreatmentAfter Treatment by SIE-RX6-900
Polarizer OCA Optical AdhesiveMany bubbles inside adhesive; uneven light transmission and mottling after laminationTransparent adhesive without bubbles; uniform light transmission after lamination
LED Encapsulation AdhesiveDense bubbles inside adhesive; accelerated LED light decay after encapsulationDense bubble-free adhesive; stable LED luminous efficiency and long service life
Fine Chemical MaterialsAbundant internal bubbles and poor dispersion, affecting material performanceUniform and dense material with qualified dispersion consistency

* Internal laboratory test data. Actual improvement varies with material formulation. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.


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