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Pressurized Debubbling Machine SIE‑RX16‑2600
Oversized Chamber for Whole‑panel Loading · Fully‑automatic Production‑grade Control with Redundant Safety Design
Oversized chamber and large‑size panel whole‑unit loading without batch processing + Fully‑automatic microcomputer production‑grade control with MES system connection support
SIENOX SIE‑RX16‑2600 Pressurized Debubbling Machine supports whole‑panel loading. Adopting fully‑automatic microcomputer control compatible with MES system connection, it is equipped with SMC digital pressure gauge with accuracy of ±0.01MPa and OMRON PID temperature control with accuracy of ±1.0℃. Multiple redundant safety measures include pressure vessel safety certificate, audio‑visual alarm and precision filter. It removes bubbles generated during laminating process by pressure and temperature to improve bonding strength between materials.
✓ ISO9001 Quality Management System ✓ RoHS Compliance ✓ Customizable voltage (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles degrade end‑product quality directly
Large‑Panel Lamination IndustryDuring lamination of large‑size LCD, commercial display and touch panels, large‑area OCA adhesive generates abundant bubbles. Batch‑split processing raises working steps and secondary‑bubble risks, bringing high loss from full‑panel scrapping. The 5230L large‑chamber pressurized debubbler realizes one‑shot debubbling for whole panels without splitting. Precise SMC pressure control ensures uniform force across full panel surface, ideal for mass‑production debubbling of large‑panel lamination. | New‑Energy Battery Slurry IndustryBubbles in high‑volume battery slurry impair coating uniformity and battery safety. Mass production demands stable large‑volume debubbling for consistent batch quality. Its 5230L large chamber processes massive slurry containers in one run. Resistive heating reaches 60 ℃ within 5 min with internal temperature deviation of ±3 ℃. Fully‑automatic microcomputer control stores and reproduces process parameters, suitable for high‑volume debubbling of battery slurry. | Semiconductor Packaging IndustryBubbles in packaging adhesive cause voids and chip failure from moisture intrusion. High‑volume packaging requires stable debubbling for reliability. Three operating modes are selectable for different adhesives. Precision filters avoid secondary material contamination. The 5230L large chamber handles numerous packaging components per cycle. Audio‑visual alarm ensures long‑term safe mass‑production operation for high‑volume semiconductor packaging debubbling. |
✨ Dilemmas of traditional debubbling: Oversized‑panel products exceed regular‑equipment chamber size and have to be processed in split batches, bringing extra procedures and high secondary‑bubble risks. Mass‑volume production requires repeated batch processing, and long queuing time delays delivery. Large‑volume pressure vessels lack multi‑redundant safety systems, posing major risks for large‑scale production. Equipment failures may cause extremely high losses for high‑value products.
Why Choose SIE‑RX16‑2600
Solve capacity, management and safety pain points for large‑panel and high‑volume mass production
5230L Oversized ChamberThe oversized cylindrical chamber reaches a capacity of 5230L, more than doubling the volume from the 1990L of RX13-1500 model. It supports one-time processing of oversized panels and mass-volume products without batch splitting. Ideal for one-step debubbling of large-size LCD panels, commercial display screens, high-volume battery slurries and semiconductor packaging components, it avoids efficiency loss and secondary bubble risks caused by batch processing. | Fully-automatic Production-grade Microcomputer ControlAdopting fully-automatic microcomputer control and supporting MES system docking, the equipment enables storage and traceability of process parameters, with one-click parameter invocation for mass production without manual intervention. In high-volume production, the automatic control eliminates manual operation errors. MES connection realizes traceable and manageable batch parameters, meeting factory audit and quality management requirements and supporting production data analysis and optimization. | Multiple Safety Redundancies & Complete CertificationsEquipped with complete pressure vessel safety certifications, audio-visual alarm system, precision filter and microcomputer fault display & alarm functions, the machine features a multi-redundancy safety design. Safety is the top priority for large-capacity pressure vessels. Complete certifications and multi-level alarms ensure long-term safe operation in large-scale mass production, effectively reducing safety risks for high-value oversized panels and mass-volume products. |
✨ If you need to process oversized‑panel products, conduct high‑volume mass production, or require high‑level safety redundancy and automation, the RX16‑2600’s oversized chamber and production‑grade control can meet your large‑scale production requirements.
Working Principle
Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.
Step 1: Pressurization & Heating (3 modes optional): Select pressure first then heating, simultaneous heating & pressurization or heating first then pressure according to material properties. Resistive heating combined with pressurization builds the defoaming environment. Step 2: Pressure Holding & Defoaming: Maintain constant pressure and temperature. Pressure compresses and dissolves bubbles on bonding surfaces; heat reduces material viscosity to help bubbles escape from bonding interfaces. Step 3: Pressure Relief & Stabilization: Slowly release pressure to atmospheric pressure. The adhesion between materials is enhanced, and bubbles on bonding surfaces are eliminated. Three simple steps: Pressurization & Heating → Pressure Holding & Defoaming → Pressure Relief & Stabilization, eliminating bonding bubbles and boosting adhesive strength. | ![]() |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE‑RX16‑2600 |
| Chamber Size | φ1600×2600mm (Cylindrical) |
| Effective Volume | Approx. 5230L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Operation Modes | A. Pressurize First Then Heat B. Simultaneous Heating & Pressurization C. Heat First Then Pressurize |
| Control Mode | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx. 2000×2900×2600mm (Subject to actual product) |
| Net Weight | 5000 kg |
| Certifications | ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
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搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
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为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Multi‑Model Specification Comparison Table
Compare Models in the Same Series for Accurate Selection
| Model | SIE-RX10-1800 | SIE-RX13-1500 | SIE-RX16-2600 |
| Chamber Size | φ1000×1800mm | φ1300×1500mm | φ1600×2600mm |
| Effective Volume | 1410L | 1990L | 5230L |
| Pressure Range | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) |
| Temperature Range | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) |
| Overall Dimension(W×D×H) | 1300×2100×2000mm | 1600×1800×2300mm | 2000×2900×2600mm |
| Net Weight | 2000 kg | 3000 kg | 5000 kg |
***The above are typical models only. Customized solutions are available upon customer requirements.
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
LCD Polarizer LaminationOCA optical adhesive for small‑size polarizers, lamination adhesive for LCD glass substrates |
Electronic Component PackagingComponent encapsulant, chip potting adhesive |
Medical DevicesMedical bonding adhesive, medical‑device lamination adhesive |
LED PackagingLED encapsulant, phosphor paste |
Fine ChemicalsFine chemical materials, nano‑powders |
New‑Energy MaterialsR&D samples of new‑energy materials, battery slurry samples |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry & Powder |
Adhesive |
Hydrogen‑Energy Materials |
Adhesive |
Substrate & Filler |
Adhesive & Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | State Before Treatment | After Treatment by SIE-RX16-2600 |
| Polarizer OCA Optical Adhesive | Many bubbles inside adhesive; uneven light transmission and mottling after lamination | Transparent adhesive without bubbles; uniform light transmission after lamination |
| Component Encapsulation Adhesive | Dense bubbles inside adhesive, voids appear in encapsulation layer after curing | Dense adhesive without voids; complete and reliable encapsulation layer |
| Medical Adhesive | Internal bubbles, bonding surface defects affect biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal laboratory test data. Actual improvement varies with material formulation. Contact sales for real customer cases.
Customer Delivery & Application Cases
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