Centrifugal Degasser

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SIENOX Centrifugal Defoaming Machine SIE‑VH960‑48


48‑position Defoaming · Multi‑station Parallel‑test Centrifugal Defoamer

Standard: 48 × 55CC containers, 0‑2000rpm stepless adjustment, non‑contact centrifugal defoaming

Parallel processing for 48 pcs of 55CC micro‑containers, enabling full‑inspection of large‑scale incoming materials in one batch. Non‑contact centrifugal separation at 0‑2000rpm, ideal for precise micro‑sample defoaming in electronics & semiconductors, optoelectronic display, laboratory R&D and other industries.

✓ Patented Design ✓ FCC Certification ✓ ISO9001 Quality System ✓ 304 Stainless‑steel Cabinet ✓ 20‑year Original Manufacturer

在线留言 免费寄样测试 工程师热线:189-2512-9293

Why Must Microbubbles in Materials Be Eliminated?

Micro‑bubbles remaining in single materials impair end‑product quality and test accuracy.

Component Packaging Industry

Residual bubbles in underfill adhesive cause packaging voids, stress concentration and poor reliability. Centrifugal defoamer separates bubbles non‑contact by centrifugal force without introducing contaminants, suitable for large‑volume single‑cup packaging adhesive defoaming.

Automotive Electronics Industry

Bubbles in wire‑harness sealant trigger poor sealing, reduced weather resistance and harness protection failure. Non‑contact centrifugal treatment avoids impurities; standardized batch setup ensures consistent performance across batches.

New Energy Industry

Bubbles in PV conductive silver paste impair grid‑line printing, contact resistance and photoelectric conversion efficiency. Non‑contact centrifugal defoaming preserves slurry chemical properties, ideal for defoaming of PV auxiliary materials.

✨ Traditional defoaming challenges: Standing defoaming works poorly for medium‑high viscosity materials. Manual stirring hardly removes deep‑seated bubbles, and contact‑type equipment may alter material properties. Centrifugal defoaming solution separates bubbles via non‑contact centrifugal force; large‑volume single‑cup setup fits medium‑high viscosity materials.

Why Choose SIE‑VH960‑48

Three Core Advantages Cover Large‑Volume Single‑Cup Defoaming Requirements

48 Pieces Processing Capacity

48 pcs of 55CC containers can be loaded at one time, and single batch capacity covers full incoming materials. No waiting for separate batches, freeing production tact from defoaming bottlenecks.

Zero Waste for Micro Vessels

55CC small vessels consume less materials per run, saving precious materials and standard samples for defoaming. Non-contact rotation inside sealed vessels enables zero-contamination sample recovery.

Traceable Process Parameters

Digital real-time display of speed and time. Defoaming parameters of each batch can be recorded and traced. Storage of 100 recipes fits multi-product changeover production. Programmed operation eliminates manual deviation.

✨ Recommended model for full inspection of mass incoming materials, micro defoaming of precious materials, and multi-process traceability.

Working Principle

High-speed rotation generates combined centrifugal force and gravity to achieve non-contact defoaming of materials inside sealed containers without altering material chemical properties.

Step 1: High-speed centrifugal separation. Set speed and time via control panel. Centrifugal force generated by high rotation separates bubbles from materials.

Step 2: Gravity-driven escape. Gravity pulls materials downward while bubbles rise to the surface and escape.

Step 3: Non-contact purity preservation. Materials rotate inside sealed syringes without mixing blades contact, leaving chemical properties unchanged.


Three simple steps: Centrifugal Separation → Gravity Escape → Non-contact Purity Preservation. Defoaming finished in one cycle.

Centrifugal Defoaming Machine Working Principle.jpg

Technical Specifications

Complete Technical Specifications Overview, Customizable on Demand

Equipment ModelSIE‑VH960‑48
Mixing Capacity30 / 55 / 75 / … / 960 cc (Customizable)
Standard Configuration55CC × 48 pcs
Number of Containers48 pcs (User‑selectable)
Max Rotation Speed0 – 2000 RPM (Stepless adjustable)
Technical PrincipleCentrifugal Defoaming
Container TypeTest tubes / Jars / Cups; Supports adapters for syringes and cartridges
Control SystemTouch screen, stores up to 100 sets of recipe parameters
Power Supply220V, 50/60Hz (110V US/Japan standard customizable)
Overall Dimension(W×D×H)980 × 735 × 490 mm
Net WeightApprox. 235 kg
CertificationsFCC, ISO9001, RoHS Compliance

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FAQ 您关心的问题

为您解答关于产品性能及日常工艺选型中的常见疑问

  • 真空脱泡搅拌机是什么?用于哪些行业?

    真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。

  • 广州施诺斯主要生产哪些设备?

    主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。

  • 源头厂家采购脱泡设备有什么优势?

    源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。

  • 搅拌脱泡机的工作原理?

    施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。

  • 为什么选择施诺斯?

    施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。

Technical Specification List

Complete Technical Specifications Overview, Customizable on Demand

Equipment ModelSIE‑VH960SIE‑VH960‑16SIE‑VH960‑48
Mixing Capacity30 / 55 / 75 / … / 960 cc (Customizable)30 / 55 / 75 / … / 960 cc (Customizable)30 / 55 / 75 / … / 960 cc (Customizable)
Standard Configuration960mL × 4 pcs300mL × 16 pcs55CC × 48 pcs
Maximum Number of Containers32 pcs32 pcs48 pcs
Max Rotation Speed0 – 2000 RPM (Stepless adjustable)0 – 2000 RPM (Stepless adjustable)0 – 2000 RPM (Stepless adjustable)
Technical PrincipleCentrifugal DefoamingCentrifugal DefoamingCentrifugal Defoaming
Container TypeTubes / Jars / CupsTubes / Jars / CupsTubes / Jars / Cups
Control SystemTouch screen, stores up to 100 sets of recipe parametersTouch screen, stores up to 100 sets of recipe parametersTouch screen, stores up to 100 sets of recipe parameters
Power Supply220V, 50/60Hz (110V US/Japan standard customizable)220V, 50/60Hz (110V US/Japan standard customizable)220V, 50/60Hz (110V US/Japan standard customizable)
Overall Dimension(W×D×H)980 × 735 × 490 mm980 × 735 × 490 mm980 × 735 × 490 mm
Net Weight235 kg235 kg235 kg
CertificationsFCCFCCFCC

*** The above are typical models only. Customized solutions are available according to customer requirements.


Multi‑Industry Solutions

Covers centrifugal defoaming applications for typical materials across six major industries

Electronic Materials.jpg

Adhesives

Polyurethane sealant, one‑component silicone, acrylic adhesive, mold silicone

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Advanced Material R&D

Nano‑dispersion, ceramic slurry, reagent gel, laboratory compounded resin

Medical Devices.jpg

Medical Consumables

Medical‑grade silicone, dental resin, biological gel, diagnostic reagent paste

LED Raw Materials02.jpg

Optoelectronic Display

Optical clear adhesive, touch‑screen silver paste, frame sealing silicone, backlight filling paste

Adhesives.jpg

New Energy Industry

Cell thermal conductive gel, battery module sealant, PV frame silicone, PV conductive silver paste

Automotive Electronics.jpg

Automotive Electronics

Vehicle‑mounted PCB potting compound, headlight encapsulation silicone, wire harness sealant, automotive thermal paste

Comprehensive Equipment Operation Demo Videos

Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.

Actual‑test Performance Demonstration

Lab Sample Actual Test Results

Gel Defoaming02.jpg

Gel

Epoxy Resin Defoaming.jpg

Epoxy Resin

Adhesive Before‑after Defoaming01.jpg

Adhesive Materials

Potting Compound Defoaming.jpg

Potting Compound

Silver Paste Mixing & Defoaming02.jpg

Silver Paste Materials

Adhesive Before‑after Defoaming02.jpg

Adhesive


Actual‑test Effect Comparison

Comparison of Material Condition Before and After Centrifugal Defoaming

Material TypeState Before TreatmentAfter Treatment by VH960-48
UnderfillDense bubbles inside adhesive, packaging void rate ~6%, poor reliabilityBubbles eliminated, packaging void rate below 1%, improved reliability
Mold SiliconeNumerous bubbles in silicone, vulcanization porosity ~7%, low molding precisionBubbles eliminated, vulcanization porosity below 2%, stable molding precision
PV Conductive Silver PasteMany bubbles in slurry, grid line breakage rate ~5%, fluctuating resistanceBubbles eliminated, grid line breakage rate below 1%, stable resistance

* Internal lab test data. Actual improvement varies with material formulation. Contact sales for real customer cases.

Customer Delivery & Application Cases

Rooted in frontline manufacturing, we empower benchmark production lines and key national research institutions across diverse industries.

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