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Pressurized Debubbling Machine SIE‑RX8‑1200
Three‑mode Programmable Process Storage · Quick Recall for Mid‑batch Production Changeover
Three‑mode Operation with Microcomputer Programmable Storage + 600L Chamber for Efficient Turnover with Fast Pressure Rise & Release
SINOS SIE‑RX8‑1200 Pressurized Debubbling Machine adopts φ800×1200 mm cylindrical chamber of approx. 600L with three programmable operation modes via microcomputer. SMC digital pressure gauge delivers ±0.01 MPa accuracy, Omron PID temperature control achieves ±1.0 ℃ precision. Pressure rises to 0.6 MPa within 5 min and pressure release completes in 2‑3 min, with single cycle lasting 35‑40 min. It eliminates bubbles generated in lamination process by pressure and temperature to enhance interfacial bonding strength.
✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom‑voltage support (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles degrade end‑product quality directly
TFT LCD Substrate Lamination IndustryDuring lamination of TFT LCD glass substrate and polarizer, residual bubbles within OCA optical adhesive cause defective display, light leakage and uneven color. The pressurized debubbler compresses and dissolves bubbles on lamination interface via pressure, while temperature reduces OCA adhesive viscosity to facilitate bubble removal. The φ800 chamber is ideal for mid‑batch debubbling of medium‑size TFT LCD substrates. Three programmable modes adapt to process parameters of different‑specification substrates. | OCA Optical Adhesive Lamination IndustryBubbles generated during OCA lamination reduce light transmittance and destabilize optical performance. Frequent parameter switching is required for mid‑batch multi‑variant production. Microcomputer‑based programmable storage saves multiple sets of process parameters for one‑click recall upon production changeover. Three operation modes are selectable according to OCA adhesive models. It fits mid‑batch multi‑variety OCA lamination debubbling with high changeover efficiency and traceable process records. | New Energy Material IndustryBubbles in new‑energy materials such as battery paste and conductive silver paste impair conductivity and coating uniformity. Stable debubbling is required to secure material performance for mid‑volume production. SMC precise pressure control cooperates with Omron PID temperature control to achieve stable and reproducible pressure‑temperature parameters. Precision filter avoids secondary material contamination, suitable for pressurized debubbling production of mid‑batch new‑energy materials. |
✨ Traditional Debubbling Pain Points: Frequent line changes are required in mid-batch and multi-variety production. Conventional devices cannot store process parameters, leading to time-consuming repeated debugging. Unaccurate pressure control causes batch fluctuations and inconsistent debubbling results. Without precision filtration and safety certifications, materials face high contamination risks and production safety cannot be guaranteed.
Why Choose SIE‑RX8‑1200
Solves efficiency and quality pain points of mid‑batch & multi‑variety production via three advantages: triple‑mode programmability, fast cycle turnover, and safe & clean guarantee
Three‑mode Programmable ProcessThree operation modes (pressurize first then heat, simultaneous heating and pressurization, heat first then pressurize) are programmable by microcomputer, and multiple groups of process parameters can be stored. For mid‑batch multi‑variety production changeover, recall corresponding process parameters with one click without repeated debugging. Changeover time is shortened from hours to minutes, greatly improving production efficiency. | Fast Pressure Rise & Release for Efficient TurnoverPressure rises to 0.6 MPa within 5 minutes, pressure release takes 2‑3 minutes. The 600L chamber features a 35‑40 min full cycle with 15‑30 min effective debubbling time. The φ800‑mm chamber offers moderate loading capacity to satisfy mid‑batch production requirements. Fast pressurization and depressurization reduce waiting time and achieve high hourly throughput. | Precision Filter for Anti‑ContaminationIncoming air is filtered by precision filter before entering the chamber to avoid dust and impurities contaminating prototype samples. R&D samples are high‑value with small quantity; one‑time contamination may waste the entire batch. Precision filtration maintains a clean prototyping environment and increases prototyping success rate. |
✨ If your mid‑batch production requires frequent line changes with demands for process‑parameter storage and safety, RX8‑1200 delivers high‑efficiency production via three‑mode programmability and fast cycle turnover.
Working Principle
Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.
Step 1: Pressurization & Heating (3 modes optional): Select pressure-first then heating, simultaneous heating & pressurization, or heating-first then pressurization according to material properties. Resistive heating combined with pressure builds the defoaming environment. Step 2: Pressure-maintained Defoaming: Hold constant pressure and temperature. Pressure compresses and dissolves bubbles on bonding interfaces, while temperature reduces material viscosity to help bubbles escape from the bonding surface. Step 3: Pressure Relief & Stabilization: Slowly release pressure to atmospheric pressure. Adhesion between materials increases and interfacial bubbles are eliminated. Simple three steps: Pressurization & Heating → Pressure-maintained Defoaming → Pressure Relief & Stabilization, eliminate bonding bubbles and boost adhesion strength. | ![]() |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE‑RX8‑1200 |
| Chamber Size | φ800×1200mm (Cylindrical) |
| Effective Volume | Approx. 600L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Operation Modes | A. Pressurize first then heat B. Simultaneous heating & pressurization C. Heat first then pressurize |
| Control Mode | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx. 1100×1500×1800mm (Subject to actual product) |
| Net Weight | 1000 kg |
| Certifications | ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么?用于哪些行业?
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备,脱泡同时混料,避免二次气泡混入,常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理,广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备?
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势?
源头厂家直供可省去中间环节,价格更透明,同时能提供参数定制、来料试机、工艺验证等服务,售后响应更直接。
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搅拌脱泡机的工作原理?
施诺斯设备采用行星式混合原理:料罐在自转的同时绕公转轴公转,物料在罐内随之翻动混合,同时抽真空脱泡。整个过程设备不设搅拌桨,搅拌部件不接触物料,不会引入金属异物,混合均匀不分层。
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为什么选择施诺斯?
施诺斯(SIENOX)是广州施诺斯科技股份有限公司旗下品牌,2014 年成立,专注脱泡机与搅拌机的研发与制造,团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计,不设搅拌桨,行星式公转加自转运动辅以真空系统,高效除泡,混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机,以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材,广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证,拥有 30 余项专利,服务富士康、比亚迪、清华大学等企业与科研院所。
Multi‑Model Specification Comparison Table
Compare Models in the Same Series for Accurate Selection
| Model | SIE‑RX4‑600 | SIE‑RX6‑900 | SIE‑RX8‑1200 |
| Chamber Size | φ400×600mm | φ600×900mm | φ800×1200mm |
| Effective Volume | 75L | 255L | 600L |
| Pressure Range | 0~2.5MPa (Optional) | 0~2.5MPa (Optional) | 0~2.5MPa (Optional) |
| Temperature Range | Ambient ~180℃ (Optional) | Ambient ~180℃ (Optional) | Ambient ~180℃ (Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) | 220V, 50/60Hz (110V US/JP standard customizable) |
| Overall Dimension(W×D×H) | 510 × 430 × 500 mm | 610 × 560 × 780 mm | 1100×1500×1800mm |
| Net Weight | 95 kg | 153 kg | 1000kg |
*** Above are typical models only. Customized solutions are available according to customer requirements.
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
TFT LCD Substrate LaminationOCA optical adhesive for medium‑size TFT substrates, LCD glass bonding adhesive |
OCA Optical Adhesive LaminationOCA optical adhesive, optically clear adhesive film |
New Energy MaterialsBattery slurry, conductive silver adhesive |
Printed Electronic MaterialsConductive ink, printed electronic slurry |
Conductive Silver AdhesiveConductive silver adhesive, silver nanowire adhesive |
Insulating AdhesiveInsulating adhesive, electronic encapsulation adhesive |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry & Powder |
Adhesive |
Hydrogen Energy Materials |
Adhesive |
Substrate & Filler |
Adhesive & Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Status Before Treatment | After Treatment by SIE‑RX8‑1200 |
| Polarizer OCA Optical Adhesive | Numerous bubbles inside adhesive, uneven light transmission & mottling after lamination | Bubble‑free transparent adhesive with uniform light transmission after lamination |
| Component Encapsulation Adhesive | Dense internal bubbles, voids formed in encapsulation layer after curing | Dense void‑free adhesive for complete and reliable encapsulation layer |
| Medical Bonding Adhesive | Internal bubbles, bonding‑surface defects impair biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal laboratory test data. Actual improvement varies with material formulations. Contact sales for real‑world customer cases.
Customer Delivery & Application Cases
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