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Pressurized Debubbling Machine SIE‑RX13‑1500
Large‑diameter Chamber for Large‑size Panels · Uniform Pressure for Consistent Full‑surface Quality
Flat loading of large‑size panels into large‑diameter chamber + SMC precise pressure control for uniform full‑surface force + Double protection with complete pressure‑vessel safety certificates
SINOS SIE‑RX13‑1500 Pressurized Debubbling Machine features a φ1300×1500 mm large‑diameter cylindrical chamber with approx. 1990L volume. Large‑size panel products can be flat‑loaded as whole units. SMC digital pressure gauge delivers ±0.01 MPa accuracy, and Omron PID temperature control reaches ±1.0 ℃. Three operation modes are available. Complete pressure‑vessel safety certificates are provided. It removes bubbles generated during lamination by pressure and temperature to improve bonding strength between materials.
✓ ISO9001 Quality System ✓ RoHS Compliance ✓ Custom‑voltage support (110V/220V)
Why Must Microbubbles in Materials Be Eliminated?
Residual micro‑bubbles degrade end‑product quality directly
Large‑panel LCD Lamination IndustryDuring lamination of large‑panel LCD glass substrates and polarizers, large‑area OCA optical adhesive generates numerous bubbles, resulting in massive display defects, light leakage and chromatic aberration after lamination, bringing huge loss from whole‑panel scrapping. The φ1300 large‑diameter chamber of pressurized debubbling machine allows whole large‑panel LCD to be flat‑loaded. SMC precise pressure control ensures uniform force over large lamination area for thorough bubble removal, ideal for large‑panel LCD lamination and debubbling production. | Automotive Touch Screen IndustryAutomotive touch screens feature large sizes and special curvatures. Bubbles generated in lamination may cause touch failure and endanger driving safety, hence stringent quality requirements. The φ1300 large‑diameter chamber accommodates large‑size automotive touch screens. Three operation modes are selectable for OCA adhesive and lamination processes. Uniform pressure within large chamber delivers consistent full‑surface debubbling for automotive touch‑screen large‑panel lamination. | Printed Electronic Materials IndustryFor printed electronic materials such as conductive inks and printed circuits, bubbles formed after printing on large‑area substrates trigger circuit open‑circuits and uneven resistance. Stable debubbling is required for mass production. The 1990L large chamber of pressurized debubbling machine processes bulk printed electronic materials in one batch. Omron PID temperature control improves ink fluidity for easy bubble discharge, while precision filter avoids secondary material contamination, suitable for mass debubbling of printed electronic materials. |
✨ Dilemmas of conventional debubbling: Large‑panel products exceed chamber size of standard equipment, requiring split‑piece processing with extra procedures; uneven pressure distribution in large‑chamber devices causes inconsistent debubbling across panels; large‑volume pressure vessels lack safety certificates and alarm systems, posing safety risks for high‑value large‑panel products.
Why Choose SIE‑RX13‑1500
Solve size, quality and safety pain‑points in large‑panel product lamination
Large Diameter Adapted for Large PanelsAdopting a large-diameter cylindrical chamber, it allows large-sized products such as large-panel LCDs and automotive touch screens to be flat-loaded as a whole without splitting processing, avoiding secondary bubbles. The 1500mm chamber length balances loading depth and floor space, and the 1990L volume enables batch processing of multiple large panels or massive materials at one time, fully meeting the production capacity requirements of large-panel production lines. | Uniform Pressure for Consistent Chamber-wide PerformanceEquipped with SMC digital pressure gauge with an accuracy of ±0.01MPa, the large-diameter chamber paired with precise pressure control ensures uniform force on all positions of large panels. Uniform stress is the core of consistent quality for large-area lamination. The φ1300 large-diameter chamber features even internal pressure distribution, delivering consistent full-surface debubbling effects and eliminating debubbling differences between the center and edges of large panels. | Complete Certification for Pressure Vessel SafetyThe large-capacity pressure vessel is equipped with a full set of safety certificates, and the S30408 stainless steel tank features excellent pressure resistance and corrosion resistance. The acousto-optic alarm system triggers synchronous alerts for abnormalities with alarm details displayed via microcomputer. Given the high value of large-panel products where equipment faults may cause batch scrapping, the dual protection of official safety certifications and intelligent alarm system ensures safe and stable large-panel production. |
✨ If you need to process large‑panel products and require full‑surface debubbling consistency & safe production, RX13‑1500’s large‑diameter chamber and uniform pressure can meet your large‑panel requirements
Working Principle
Remove bubbles generated during lamination by pressure and temperature to enhance bonding strength between different materials.
Step 1: Pressurization & Temperature Rise (Three Modes Optional) Step 2: Pressure‑holding Debubbling Step 3: Pressure Relief & Stabilization Three simple steps: Pressurization & Temperature Rise → Pressure‑holding Debubbling → Pressure Relief & Stabilization, eliminate lamination bubbles and improve bonding strength. |  |
Technical Specifications
Complete Technical Specifications Overview, Customizable on Demand
| Model | SIE-RX13-1500 |
| Chamber Size | φ1300×1500mm (Cylindrical) |
| Effective Volume | Approx. 1990L |
| Working Pressure | 0~0.8MPa (Standard), 0~2.5MPa (Optional) |
| Working Temperature | Ambient ~80℃ (Standard), Ambient ~180℃ (Optional) |
| Heating Method | Resistive Heating |
| Operation Modes | A. Pressurize First Then Heat B. Simultaneous Heating & Pressurization C. Heat First Then Pressurize |
| Control Mode | Microcomputer Control |
| Vessel Material | S30408 Stainless Steel or Carbon Steel |
| Overall Dimension(W×D×H) | Approx. 1600×1800×2300mm (Subject to actual product) |
| Net Weight | 3000 kg |
| Certifications | ISO9001, RoHS Compliance |
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FAQ 您关心的问题
为您解答关于产品性能及日常工艺选型中的常见疑问
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真空脱泡搅拌机是什么？用于哪些行业？
真空脱泡搅拌机是在真空环境下同步完成搅拌与脱泡的设备，脱泡同时混料，避免二次气泡混入，常用于环氧树脂、硅胶、AB 胶等高粘度材料的混料脱泡处理，广泛应用于新能源电池、半导体封装、LED、电子灌封、胶粘剂等行业。
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广州施诺斯主要生产哪些设备？
主要产品包括搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材。
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源头厂家采购脱泡设备有什么优势？
源头厂家直供可省去中间环节，价格更透明，同时能提供参数定制、来料试机、工艺验证等服务，售后响应更直接。
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搅拌脱泡机的工作原理？
施诺斯设备采用行星式混合原理：料罐在自转的同时绕公转轴公转，物料在罐内随之翻动混合，同时抽真空脱泡。整个过程设备不设搅拌桨，搅拌部件不接触物料，不会引入金属异物，混合均匀不分层。
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为什么选择施诺斯？
施诺斯（SIENOX）是广州施诺斯科技股份有限公司旗下品牌，2014 年成立，专注脱泡机与搅拌机的研发与制造，团队自 2006 年起从事真空搅拌脱泡设备研发。设备采用非接触式设计，不设搅拌桨，行星式公转加自转运动辅以真空系统，高效除泡，混合均匀不分层。公司产品涵盖搅拌脱泡机、真空脱泡搅拌机、真空脱泡机、高压脱泡机、真空搅拌机、实验室均质机、三辊研磨机、三维混粉机，以及点胶机、分装机等配套设备和夹具、搅拌罐、针筒等辅品耗材，广泛应用于新能源、半导体、LED、电子灌封、胶粘剂、涂料、油墨等行业。通过 ISO9001、CE 认证，拥有 30 余项专利，服务富士康、比亚迪、清华大学等企业与科研院所。
Multi‑Model Specification Comparison Table
Compare Models in the Same Series for Accurate Selection
| Model | SIE-RX8-1200 | SIE-RX10-1800 | SIE-RX13-1500 |
| Chamber Size | φ800×1200mm | φ1000×1800mm | φ1300×1500mm |
| Effective Volume | 600L | 1410L | 1990L |
| Pressure Range | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) | 0~2.5MPa(Optional) |
| Temperature Range | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) | Ambient ~180℃(Optional) |
| Pressure Accuracy | ±0.01MPa | ±0.01MPa | ±0.01MPa |
| Temperature Control Accuracy | ±1.0℃ | ±1.0℃ | ±1.0℃ |
| Power Supply | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) | 380V, 50/60Hz (Customizable for 110V US/JP standard) |
| Overall Dimension(W×D×H) | 610 × 560 × 780 mm | 1300×2100×2000mm | 1600×1800×2300mm |
| Net Weight | 163 kg | 2000 kg | 3000 kg |
***The above are typical models only. Customized solutions are available upon customer requirements.
Multi‑Industry Solutions
Covering stirring and debubbling applications of typical materials across six major industries
LCD Polarizer LaminationSmall‑size polarizer OCA optical adhesive, lamination adhesive for LCD glass substrate |
Electronic Component EncapsulationComponent encapsulant, chip potting adhesive |
Medical DevicesMedical bonding adhesive, medical device lamination adhesive |
LED EncapsulationLED encapsulant, phosphor paste |
Fine ChemicalsFine chemical materials, nano‑powders |
New Energy MaterialsR&D samples of new energy materials, battery slurry samples |
Comprehensive Equipment Operation Demo Videos
Gain intuitive, clear, dynamic insight into synchronous defoaming with planetary centrifugal force and high negative pressure.
Actual‑test Performance Demonstration
Measured Processing Results for Six Typical Materials
Slurry + Powder |
Adhesive |
Hydrogen Energy Materials |
Adhesive |
Substrate + Filler |
Adhesive + Ceramic Powder |
Actual‑test Effect Comparison
Comparison of Material Status Before and After Pressurized Debubbling
| Material Type | Pre‑treatment Status | After SIE‑RX13‑1500 Treatment |
| Polarizer OCA Optical Adhesive | Numerous bubbles inside adhesive, uneven light transmission and mottling after lamination | Bubble‑free transparent adhesive with uniform light transmission after lamination |
| Component Encapsulant | Dense internal bubbles, voids formed in encapsulation layer after curing | Dense void‑free adhesive for complete and reliable encapsulation layer |
| Medical Bonding Adhesive | Internal bubbles cause bonding‑surface defects and impair biocompatibility | Dense adhesive with intact bonding surface and qualified biocompatibility |
* Internal lab test data. Actual improvement varies with material formulation. Contact sales for real‑world customer cases.
Customer Delivery & Application Cases
Rooted in manufacturing frontlines, empowering benchmark production lines and key national research institutions across diverse industries.
